A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

This application provides a board-level architecture and a communications device. The board-level architecture includes a support board, a switch board, and a press fit component. The press fit component includes a cable, a first connector component press-fitted on a side edge of the support board, and a second press fit cable connector press-fitted on a side edge of the switch board. The first connector component includes a first press fit cable connector and a pluggable connector that is electrically connected to the first press fit cable connector, and the pluggable connector is farther from the support board than the first press fit cable connector. The first press fit cable connector is connected to the second press fit cable connector through the cable.

A printed circuit board corner connector designed to connect a first printed circuit board to a second printed circuit board, having a substantially flat contact body, from which a first connection end for connecting to the first printed circuit board extends, wherein two soldering pins for producing a soldered connection to the second printed circuit board protrude from a lateral surface of the contact body, wherein depressions are provided on lateral surface lying opposite lateral surface in positions corresponding to the soldering pins.

A memory module mounting apparatus for coupling a memory module to a processor of an information handling system includes a z-axis compression connector and a compression connector mount. The z-axis compression connector has first compression contacts on a first surface of the compression connector and second compression contacts on a second surface of the compression connector. The first compression contacts couple the compression connector to the processor. The compression connector mount has contact pads on a first surface of the compression connector mount. The first contact pads couple the compression connector mount to the first compression contacts, and have contact elements configured to couple the contact pads to the memory module.

A circuit board includes a terminal area projecting from an end face of the circuit board. The terminal area is flush with a front side and a back side of the circuit board and has a thickness equal to the circuit board. The terminal area has a plurality of sides covered with an electrically conductive material, the sides including a first surface flush with a front side of the circuit board, a second surface flush with a back side of the circuit board, and a pair of side surfaces that intersect the first surface and the second surface.

A circuit interrupter including a line conductor, a printed-circuit board, and a test circuit. The printed-circuit board coil is embedded on a printed circuit board. The printed circuit board includes a slot through the printed-circuit board coil, wherein the line conductor is received by the printed-circuit board coil. The test circuit is electrically connected to the printed-circuit board coil. The test circuit is configured to determine a condition of the line conductor based on a signal of the printed-circuit board coil.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

An LED assembly includes an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

A circuit board arrangement (100) for a motor controller in a motor housing (50) has at least one first populated circuit board (LP1) and one second populated circuit board (LP2). Contact elements (20) are plugged together in the plug-in direction (S) in order to produce a detachable electrical connection with the first circuit board (LP1). An alignment and guidance device (LP3) protrudes from the first circuit board (LP1) in the plug-in direction (S) toward the second circuit board (LP2). In the assembled state, the contact elements (20) are completely in the plugged-in state with mating contacts (10) of the first circuit board (LP1). An end-side portion (30), of the device (LP3), protrudes through a gap (21) in the second circuit board. The contact elements (20) protrude from or out of the second circuit board (20) in different lengths.