Electronic device fastening systems that enable one or more electronic devices to be reliably and quickly secured on a host board and electronic systems made of the same. In a specific exemplary embodiment, a retainer clip spans across the width of one or more electronic devices, engages with the board and snaps into place. The clip includes one or retaining posts such that when the clip engages the board, the one or more retaining posts align and engage with a predefined mounting feature of a corresponding one of the one or more electronic devices, thereby securing the electronic device in place to restrict horizontal, lateral, and vertical movement of the electronic device.

A laser ignition assembly comprises first and second mounting surfaces opposed to each other. A central cavity is formed through the surfaces and sized to receive energetic material therein. A vertical solder bridge is formed between the surfaces and an edge emitting laser diode disposed between the surfaces. The laser diode is oriented such that a light fluence therefrom is directed in a radial direction into the central cavity. The surfaces can be circuit boards, e.g., copper clad, rigid circuit boards, and have an annular shape. The central cavity can be further defined by an interboard gap between the surfaces. The ignition assembly can fit within a primer cup of a munition.

A circuit board assembly and electronic device are provided that improve the reliability of the connection between circuit boards and electronic components. The circuit board assembly includes a first circuit board, including a first side surface and a first sidewall pad, where the first sidewall pad is disposed on the first side surface, a second circuit board, fastened to the first circuit board, where the first sidewall pad is located at a position close to the second circuit board, and sidewall solder, adhered to the first sidewall pad and the second circuit board.

A connector is mounted on an input-output board. The connector is interposed between the input-output board and a CPU board, and thereby a plurality of pads of the input-output board and a plurality of pads of the CPU board are respectively electrically connected. The connector includes a rectangular flat-plate housing having a first positioning hole and a second positioning hole, and at least one contact row held on the housing. The first positioning hole is formed at a first housing corner part of the housing. The second positioning hole is formed at a fourth housing corner part, which is at a diagonal position with respect to the first housing corner part, of the housing.

A component carrier assembly includes a first component carrier having a first electrically insulating layer structure and a via in the first electrically insulating layer structure, where the via is at least partially filled with electrically conductive material and where an upper part of the via extends beyond an outer main surface of the first component carrier; and a second component carrier having a second electrically insulating layer structure, and an electrically conductive adhesive material that is at least partially embedded in the second electrically insulating layer structure. The first component carrier and the second component carrier are interconnected and the upper part of the via at least partially penetrates into the electrically conductive adhesive material.

Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.

An electronic device, comprising: a first functional board, a second functional board, and a connector main body, wherein the connector main body is a PCB, wherein a plurality of via holes are formed in the PCB, wherein soldering pads are arranged in the via holes, and wherein the soldering pads are used for communicating the first functional board and second functional board, wherein the PCB is provided with a space for accommodating elements on the first and second functional boards, wherein the soldering pads on both sides of the connector are respectively connected with the soldering pad of the first functional board and the soldering pad of the second functional board.

Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.

A printed circuit board (PCB) assembly with a first PCB connected to a second PCB with a flexible interconnect and a vapor chamber for positioning between the first PCB and the second PCB. The flexible interconnect allows the PCB assembly to be in an open configuration or a closed configuration. In the closed configuration, the vapor chamber is between the two PCBs. The flexible interconnect supplies a portion of the electric power from the first PCB to the second PCB and a power connector supplies a second portion of the electric power. Grounding springs allow localized grounding of the PCB assembly. The flexible interconnect, the power connector and the grounding springs provide structural support for the second PCB. The vapor chamber may be longer than the PCBs to draw heat away from components and the flexible interconnect may be used as an airflow guide for improving airflow over components.

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.