Provided is a board coupling structure in which a power supply circuit board is formed as a separate board, more specifically, to a board coupling structure in which a signal processing circuit board for processing signals such as image signals, voice signals, and the like and a power supply circuit board are formed as different types of boards and the different types of boards are laterally coupled to each other. The board coupling structure includes a first circuit board, a second circuit board formed of a smaller number of layers than the number of layers of the first circuit board, and a fastening unit configured to laterally fasten a contact edge of the first circuit board to a contact edge of the second circuit board which are facing each other.

A hybrid integration method includes: assembling a motherboard chip, assembling a daughterboard chip, and assembling an integrated chip. The motherboard chip includes a motherboard chip body, a first metal region, a first vertical support assembly, and a first waveguide region arranged on the motherboard chip body, and the first waveguide region includes a first conventional waveguide region and a first coupling waveguide region used for vertical coupling which are fixedly connected to each other; the daughterboard chip includes a daughterboard chip body, a second metal region, a second vertical support assembly and a second waveguide region arranged on the daughterboard chip body, and the second waveguide region includes a second conventional waveguide region and a second coupling waveguide region used for vertical coupling which are fixedly connected to each other.

The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

A plug connector provides an electrical connection to a conductor track connection of a printed circuit board. The plug connector has a first printed circuit board with a conductor track connection and a plugging region for plugging the printed circuit board into the plug connector. The plugging region extends parallel to the first printed circuit board. A contact element and/or a spring element is provided in the plug connector. The plugging region and the contact element and/or the spring element are arranged in such a way that, in a plugged state of the plug connector, the printed circuit board which is plugged into the plugging region is arranged parallel to the printed circuit board and the conductor track connection is arranged opposite the conductor track connection. An electrical connection of the conductor track connection to the conductor track connection is provided by the contact element and/or the spring element.

A surface mount technology (SMT) terminal header is described for providing an electrical connection to a first printed circuit board (PCB). The SMT terminal header includes multiple first electrically conductive connector elements each having a base configured for surface mount attachment to the first PCB, and an insulative housing having multiple cells and a fixation member configured to attach the housing to the first PCB. Each of the multiple cells is configured to at least partially house one of the multiple first electrically conductive connector elements. Each of the first electrically conductive connector elements includes a position assurance member configured to attach the first electrically conductive connector element to at least one of the multiple cells of the insulative housing.

This anisotropic conductive sheet includes: an insulating layer having a first surface and a second surface; and a plurality of conductive paths which are disposed so as to extend in the thickness direction inside the insulating layer and which are respectively exposed to the outside of the first surface and the second surface. The circumferential surface of the conductive paths includes a region where the surface area ratio represented by equation (1) is at least 1.04. Equation (1): surface area ratio = surface area / area

The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side

A circuit board arrangement (100) for a motor controller in a motor housing (50) has at least one first populated circuit board (LP1) and one second populated circuit board (LP2). Contact elements (20) are plugged together in the plug-in direction (S) in order to produce a detachable electrical connection with the first circuit board (LP1). An alignment and guidance device (LP3) protrudes from the first circuit board (LP1) in the plug-in direction (S) toward the second circuit board (LP2). In the assembled state, the contact elements (20) are completely in the plugged-in state with mating contacts (10) of the first circuit board (LP1). An end-side portion (30), of the device (LP3), protrudes through a gap (21) in the second circuit board. The contact elements (20) protrude from or out of the second circuit board (20) in different lengths.

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.