Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

The present disclosure provides a micro-rough electrolytic copper foil and a copper clad laminate. The electrolytic copper foil has a micro-rough surface formed with mountain-shaped structures and recessed structures. A multiplication value of an arithmetic mean height (Sa) and a vertex density (Spd) of the mountain-shaped structures measured according to ISO 25178 is between 150000 μm/mm.sup.2 and 400000 μm/mm.sup.2. An arithmetic mean undulation (Wa) of the mountain-shaped structures measured according to JIS B0601:2001 is between 0.06 μm and 1.5 μm. Therefore, the electrolytic copper foil with good binding strength and electrical properties can be obtained.

A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.

A seeded substrate is first prepared. The seeded substrate includes an insulation substrate having a main surface composed of a first region and a second region other than the first region, and a conductive seed layer provided on the first region. Subsequently, a conductive layer is formed on at least the second region to obtain a first treated substrate. An insulation layer is then formed on the first treated substrate. The seed layer is then exposed. A metal layer is then formed on the surface of the seed layer. Here, a voltage is applied between the anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing solution being disposed between the second treated substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the insulation layer and the conductive layer are removed.

A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point: a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein hearing is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.

High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

A base material for a printed circuit board includes a base film having an insulating property, and a sintered body layer including metal particles and layered on at least one surface of the base film. The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film. The embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%.