Patent classifications
H
ELECTRICITY
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H05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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3/00
Apparatus or processes for manufacturing printed circuits
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H05K3/38
Improvement of the adhesion between the insulating substrate and the metal
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H05K3/386
by the use of an organic polymeric bonding layer, e.g. adhesive
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