A method of making an assembly can include juxtaposing a top surface of a first electrically conductive element at a first surface of a first substrate with a top surface of a second electrically conductive element at a major surface of a second substrate. One of: the top surface of the first conductive element can be recessed below the first surface, or the top surface of the second conductive element can be recessed below the major surface. Electrically conductive nanoparticles can be disposed between the top surfaces of the first and second conductive elements. The conductive nanoparticles can have long dimensions smaller than 100 nanometers. The method can also include elevating a temperature at least at interfaces of the juxtaposed first and second conductive elements to a joining temperature at which the conductive nanoparticles can cause metallurgical joints to form between the juxtaposed first and second conductive elements.

A high frequency module includes a module substrate that includes main surfaces facing each other, a power amplifier that is disposed on the main surface and capable of amplifying a transmission signal, an external connection terminal that is disposed on the main surface and set to a ground potential, and a via conductor that is formed inside the module substrate and connects the main surfaces. One end of the via conductor is bonded to a ground electrode of the power amplifier on the main surface, and the other end of the via conductor is bonded to an end surface of the external connection terminal on the main surface. An area Rb of an end surface that is opposite to the end surface of the external connection terminal is larger than an area of a cut surface that is in parallel to the main surface of the external connection terminal.

A printed circuit board structure is disclosed for providing reliable solderability for higher density component placement. The printed circuit board structure includes conductive points disposed on the surface of a printed circuit board which are separated by a channel disposed in the surface of the printed circuit board between the conductive points. The conductive points may be surface mount component terminal pads. The printed circuit board structure is particularly useful for overcoming component density limitations related to extremely miniaturized surface mount components known in the art.

A surface mount component can include a first substrate and a second substrate arranged adjacent the first substrate to form a monolithic body. At least one of the first substrate or the second substrate can include a thermally conductive material that is electrically insulating. A thin film component can be arranged between the first substrate and the second substrate. A first terminal can be formed over a first end of the monolithic body. A second terminal can be formed over a second end of the monolithic body that is opposite the first end. A heat sink terminal can contact the thermally conductive material of the at least one of the first substrate or the second substrate.

To protect memory cards, such as SD type cards, and similar devices from Electrostatic Discharge (ESD), the input pads of the device include points along their edges that are aligned with correspond points on a conductive frame structure mounted adjacent the input pad to form a spark gap. The input pads are connected to a memory controller or other ASIC over signal lines that include a diode located between the input pad and the ASIC and a resistance located between the input pad and the diode. The resistance and diode are selected such that an ESD event at an input pad triggers a discharge across the spark gap before it is transmitted on to the ASIC, while also allowing a high data rate for signals along the signal line.

A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the base portion in a plan view at a lower end of the side surface of the base portion. The insulating layer is provided with a groove that is located in a periphery of the pad in the plan view, exposes a side surface of the pad, and opens to an upper surface of the insulating layer.

An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including pads, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the pads, and plating bumps formed on the pads such that each plating bump includes a base plating layer formed in a respective one of the openings, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer. The plating bumps are formed such that the base plating layer has a side surface including a portion protruding from the solder resist layer, that the intermediate layer has a thickness in a range of 2.7 to 7.0 μm, and that the top plating layer has a hemispherical shape and is covering only an upper surface of the intermediate layer.