Provided is a circuit board including inspection terminals, the circuit board including: a connection terminal, which is arranged on a front surface or in an inner layer of the circuit board, and is electrically connected to an object to be inspected; and three or more inspection terminals, which are electrically connected to the connection terminal, and are configured to measure a resistance value of the object to be inspected, each of the three or more inspection terminals being arranged on a side surface of the circuit board.

Provided is a circuit board including an inspection terminal, the circuit board including: a connection terminal, which is arranged on a front surface or in an inner layer of the circuit board and is electrically connected to an object to be inspected; an inspection terminal configured to measure a resistance value of the object to be inspected; and a connection wiring configured to electrically connect the object to be inspected and the inspection terminal to each other, the inspection terminal being arranged on a side surface of the circuit board, at least a part of the connection wiring being formed on a back surface or in the inner layer of the circuit board.

A wiring board includes: a glass substrate serving as a substrate, which includes a first surface, a second surface which is opposite to the first surface, and a side surface; an input electrode serving an electrode, which is located close to a side of the first surface; an insulating layer disposed on the glass substrate; and a side wiring disposed so as to extend from the input electrode via the side surface to the second surface. An end of the insulating layer located close to the side is provided with a cutaway portion extending in an inward direction of the insulating layer, the input electrode is disposed in an entrance-side part of the cutaway portion, and the cutaway portion includes a bottom-side part constituting an inward area which is free of the input electrode.

Provided are a flexible circuit mother board and a detection method. The flexible circuit mother board includes flexible circuit daughter boards, at least one detection terminal group and external pad groups corresponding to the flexible circuit daughter boards in one-to-one correspondence. Each flexible circuit daughter board has a bonding pad area adjacent to a corresponding one of the plurality of external pad groups. Each detection terminal group detects at least one flexible circuit daughter board, and each of the at least one detection terminal group comprises a plurality of detection terminals. Each flexible circuit daughter board includes a plurality of capacitors including a first electrode plate and a second electrode plate. Each of the first electrode plate and the second electrode plate is electrically connected to one detection terminal.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

The disclosure relates to systems and methods for using additive manufacturing (AM) to fabricate printed circuits having side-mounted components and contacts. More specifically, the disclosure is directed to additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB's together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each of the printed AMEs.

A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.

A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate in an offset pattern. An electrical component is disposed in a die attach area over a first surface of the substrate. The conductive vias are formed around the die attach area of the substrate. A first conductive layer is formed over the first surface of the substrate, and a second conductive layer is formed over the second surface. An encapsulant is deposited over the substrate and electrical component. The substrate is singulated through the conductive vias. A first conductive via has a greater exposed surface area than a second conductive via. A shielding layer is formed over the electrical component and in contact with a side surface of the conductive vias. The shielding layer may extend over a second surface of substrate opposite the first surface of the substrate.

In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.