A cable connection apparatus, a connection assembly, and a method for manufacturing the connection assembly are provided. The cable connection apparatus includes: a back plate and a connection member. The back plate includes a plate body and a ground layer. The plate body defines a through hole and a plurality of shielding holes. The plurality of shielding holes are defined at a periphery of the through hole. The ground layer is arranged on each of two opposite sides of the plate body and is connected to each of the plurality of shielding holes. The connection member abuts against or connects to a surface of a side of the back plate arranged with the ground layer. The connection member is arranged with a signal pin, and the signal pin is received in the through hole.

A deposition apparatus includes a first substrate support for supporting a substrate in a substantially vertical orientation. The substrate has a first main surface, a second main surface opposite the first main surface and a side surface between the first main surface and the second main surface. The deposition apparatus includes a first deposition device for depositing a first conductive pattern or a first resist mask on the side surface of the substrate while the substrate is supported in the substantially vertical orientation by the first substrate support.

A through-hole via penetrating, in a thickness direction, through a circuit board provided with multiple wiring layers in which a conductor pattern is formed on a surface of an insulating layer, wherein the through-hole via has a first through-hole conductor that is disposed inside a hole penetrating through the circuit board and that is formed from a conductor; a second through-hole conductor that is disposed inside the hole so as to be spaced, in a circumferential direction of the hole, from the first through-hole conductor; a first land portion that connects the first through-hole conductor to the conductor pattern on one insulating layer; and a second land portion that connects the first through-hole conductor with the second through-hole conductor on another insulating layer different from the one insulating layer.

Disclosed is a measuring sensor of a measuring device for detecting a mass flow rate. The measuring sensor comprises a measuring tube, a vibration exciter, and at least two vibration sensors. The vibration exciter and the vibration sensors each have a coil apparatus having at least one coil and at least one magnetic apparatus. The coil apparatus comprises a printed circuit board having at least one printed circuit board layer, wherein the coil is formed by means of an electrically conductive conductor track, wherein the coil is arranged on the first side and/or second side of a printed circuit board layer, wherein the printed circuit board comprises at least two contact-making elements for connecting the coil to an electronic measuring and/or operating circuit of the measuring device by means of connection elements, and is characterized in that at least one contact-making element has a hole.

In an electric field probe for use in calibration of electromagnetic susceptibility testing equipment, processing circuitry for converting electric fields to digitally modulated light transmitted by a fiber optic cable, and circuitry for converting light supplied through a fiber optic cable to current for operating the processing circuitry, are on printed circuit boards that have border portions with conductive edge plating clamped between opposed edges of shells that form a circuit board enclosure. Antenna elements comprising conductive traces on the circuit boards protrude outward from the enclosure through gaps in the plating

Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

A blind plug, in particular an RJ45 blind plug, includes at least one data plug unit, which is configured for a connection to a counter data plug unit, in particular an RJ45 plug socket, wherein the data plug unit includes an output unit, which is configured to indicate a power supply capability of the counter data plug unit.

A cable connection apparatus, a connection assembly, and a method for manufacturing the connection assembly are provided. The cable connection apparatus includes: a back plate and a connection member. The back plate includes a plate body and a ground layer. The plate body defines a through hole and a plurality of shielding holes. The plurality of shielding holes are defined at a periphery of the through hole. The ground layer is arranged on each of two opposite sides of the plate body and is connected to each of the plurality of shielding holes. The connection member abuts against or connects to a surface of a side of the back plate arranged with the ground layer. The connection member is arranged with a signal pin, and the signal pin is received in the through hole.

A display apparatus includes a first base substrate defining: an outer edge thereof at which a side surface is exposed, and an upper surface thereof connected to the outer edge; first and second guiding dams on the upper surface and extending from an inside of the first base substrate to the outer edge; a first signal line on the upper surface and extending between the first and second guiding dams from the inside of the first base substrate to the outer edge thereof; and a first side pad connected to the first signal line. The first side pad includes a first horizontal portion on the upper surface and extending between the first and second guiding dams, in a top plan view, and the first horizontal portion extending to define a first vertical portion which is disposed on the side surface.