A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

A circuit board comprises a row of solder pads adapted to be soldered to a row of contacts of a connector, a plurality of first conductive vias, and a plurality of second conductive vias. The contacts include a plurality of ground contacts and a plurality of signal contacts. The solder pads include a plurality of ground solder pads each soldered to a solder foot of one of the ground contacts and a plurality of signal solder pads each soldered to a solder foot of one of the signal contacts. The first conductive vias correspond to and are electrically connected to the ground solder pads and are electrically connected to each other by a first connection bar. The second conductive vias correspond to and are electrically connected to the ground solder pads and are electrically connected to each other by a second connection bar. The solder foot of each of the ground contacts is disposed between one of the first conductive vias and one of the second conductive vias.

The disclosure relates to electronics of an electric motor of a motor vehicle, having a connection unit that is placed in electrical contact with a circuit board and attached thereto. The connection unit has a number of leadframes that are stabilized with respect to one another. The connection unit at least partly forms a connector socket for a mating connector, and the connection unit at least partly forms a contact point for an electromagnet of the electric motor.

A lighting unit for a vehicle has a light source carrier with an arrangement of data lines. The lighting unit also has a plurality of light sources positioned on the light source carrier, each of which has an integrated control unit and which are interconnected via the arrangement of data lines in order to exchange data according to a predefined protocol. The rear face of the light source carrier has a plurality of cavities. The front face of the light source carrier is light-conductive, at least in the region of the cavities. The arrangement of data lines is on the rear face of the light source carrier and the line ends of the data lines lead up to or into the number of cavities. At least one light source is fitted into each of the plurality of cavities, such that each light emission surface is oriented towards the floor of the cavity and the light source is electrically contacted and held in the cavity by electrical and mechanical contact with the line ends of the data lines.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of or in the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.