A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.

An electronic device having a first component carrier and an electronic component which is surface mounted on or embedded within the first component carrier. The electronic device further has a second component carrier. The first component carrier together with the electronic component is at least partially embedded within the second component carrier.

To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Multiple designs for a multi-layer circuit may be simulated to determine impedance profiles of each design, allowing a circuit designer to select a design based on the impedance profiles. One feature that can be modified is the structure surrounding the barrels of a differential VIA on layers that are not connected to the differential VIA. Specifically, one antipad can be used that surrounds both barrels or two antipads can be used, with one antipad for each barrel. Additionally, the size of the antipad or antipads can be modified. These modifications affect the impedance of the differential VIA. Additionally, a conductive region may be placed that connects to the VIA barrel even though the circuit on the layer does not connect to the VIA. This unused pad, surrounded by a non-conductive region, also affects the impedance of the differential VIA.

A method for manufacturing a multilayer printed wiring board includes: preparing a first wiring board that includes a circuit region formed with one or more signal lines on a main surface of a first insulating substrate; preparing a second wiring board that includes an electrically conductive layer on a main surface of a second insulating substrate; disposing a spacer at a position spaced apart from an outer edge of the circuit region by a predetermined distance along at least a part of the outer edge; disposing an adhesive layer on the circuit region so that a space is provided between the adhesive layer and the spacer; and laminating the first wiring board and the second wiring board for thermocompression bonding.

The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.

An electronic device including a first conductive element, a second conductive element, a substrate, and a conductor is provided. The first conductive element has a first region. The substrate has a through hole. The first through hole is disposed between the first conductive element and the second conductive element. The conductor electrically connects the first conductive element to the second conductive element through the through hole. The through hole is partially surrounded by the first region.