A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

A printed circuit board (PCB) comprises two or more PCB layers comprising of a dielectric core and conductive cladding on adjoining surfaces; one or more DC lines embedded in one or more layers of the two or more PCB layers; one or more RF signal lines embedded in one or more layers of the two or more PCB layers; wherein the one or more DC lines crosses over/under at least one of the RF signal lines to form at least one crossover, wherein the at least one crossover is no thicker than the PCB layer in which it is situated. The printed circuit board of claim 1, further comprising two or more generally parallel DC lines which converge to form a stack of superposed parallel DC lines where the two or more DC lines cross over the one or more RF signal lines.

A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Provided in one example is an article. The article including: a first electrode; a switching layer disposed over at least a portion of the first electrode, the switching layer including a metal oxide; and a second electrode disposed over at least a portion of the switching layer. The first electrode, the switching layer, and the second electrode are parts of a resistive random-access memory, and one or both of the first electrode and the second electrode is a part of a layer of a printed circuit board.

A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

An electronic component module includes a substrate with a first main surface and a second main surface. Mount electronic components and a second conductive member are mounted on the second main surface, and the second conductive member is disposed between the mount electronic component and the mount electronic component. The second conductive member is connected to a shield film disposed near the second main surface through a depression. Mount electronic components and a first conductive member are mounted on the first main surface, and the first conductive member is disposed between the mount electronic component and the mount electronic component. The first conductive member is connected to a shield film disposed near the first main surface through a depression.

Disclosed is an integrated circuit arrangement including a two sided circuit board, having a first surface and a second surface. A plurality of electrical conductors is incorporated as part of the two sided circuit board. An array of through holes extend through the first surface and the second surface, arranged in a pattern and are configured to provide a common electrical connection area, wherein the common electrical connection area is associated with a portion of a particular one of the plurality of electrical conductors.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

A touch structure and a method of manufacturing the touch structure are provided. The method includes: forming a first conductive layer on a base substrate; forming a second conductive layer on the first conductive layer; and patterning the first conductive layer and the second conductive layer to respectively form a first conductive layer pattern and a second conductive layer pattern; the first conductive layer pattern is formed after the second conductive layer pattern is formed, and the first conductive layer pattern and the second conductive layer pattern are different from each other.