A method for manufacturing circuit board, including: providing a substrate; printing a first conductive layer on a surface of the substrate, the first conductive layer includes a plurality of electrode units arranged in an M*N array, each of the electrode units includes a first electrode, and a plurality of second electrodes distributed around the first electrode; printing a first insulating layer on a side of the first conductive layer away from the substrate; printing a second conductive layer on a side of the first insulating layer away from the substrate; printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode. A circuit board is also provided.

A display device includes a display panel including a plurality of pixels, a touch sensor unit provided on the display panel, and including a touch sensing area in which a touch sensor is provided and a non-sensing area around the touch sensing area, and a polarizer provided on the touch sensor unit and bonded to the touch sensor unit, an edge side of the polarizer and an edge side of the touch sensor unit being aligned.

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

A touch module and a manufacturing method thereof, and a touch screen are provided. The method of manufacturing a touch module includes: forming a composite electrode, a lead, and a lead pad each of which has a stacked structure of a transparent conductive layer and a metal layer on a substrate by one patterning process, the touch module including a touch area, and a peripheral area and a bonding area located at the periphery of the touch area, the composite electrode being formed in the touch area, the lead being formed in the peripheral area, and the lead pad being formed in the bonding area; forming a protective layer outside the touch area, and etching away the metal layer of the composite electrode to form a transparent touch electrode.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. Conductive traces having varying thickness may be produced on a common substrate. Conductive regions are printed to electrically isolate traces and optional to present an approximately level surface.

A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.