An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.

A vacuum cleaner of the present invention comprises: a main body having a suction motor for generating suction force; a main PCB capable of generating a control command for the suction motor; a handle part capable of accommodating the main body PCB; and a connector provided at the main body, and to which the main PCB is connected in a process of coupling the handle part to the main body. The main PCB includes a plurality of pads and a slit, and the connector includes: a plurality of connecting pins for making contact with the plurality of pads; and a slit insertion protrusion inserted into the slit.

According to an embodiment of the present invention, an electronic device may comprise: a housing; a printed circuit board disposed inside the housing, the printed circuit board comprising a first surface, a second surface facing away from the first surface, and a first through-hole and a second through-hole penetrating the first surface and the second surface; a first microphone disposed on the second surface so as to at least partially overlap the first through-hole when seen from above the first surface; a second microphone disposed on the second surface so as to at least partially overlap the second through-hole when seen from above the first surface; a support member disposed on the first surface, the support member comprising a third surface facing the first surface, a fourth surface facing away from the third surface, a third through-hole at least partially overlapping the first through-hole when seen from above the first surface, and a fourth through-hole at least partially overlapping the second through-hole when seen from above the first surface; a first sound-transmitting member disposed on the fourth surface so as to at least partially overlap the third through-hole; and a second sound-transmitting member disposed on the fourth surface so as to at least partially overlap the fourth through-hole. Various other embodiments may be included.

A power converter includes a tubular housing having an accommodation space, a first and a second openings. A power module is disposed in the accommodation space and includes a circuit board and a first fastening portion. A bottom cover is formed with a second fastening portion and first bumps, and the bottom cover is pre-positioned on the tubular housing through the second fastening portion engaged with the first fastening portion. A bottom cover is bonded to the first opening through melting the first bumps by ultrasonic welding. A power cable is inserted through the bottom cover and electrically connected to the circuit board. A power socket is coupled to the second opening.

Systems and methods for embedding electronics in a housing using additive manufacturing are provided. In certain embodiments, a system includes a housing made using an additive manufacturing process. The system also includes at least one electronics assembly that is embedded into the housing during the additive manufacturing process, wherein one or more electronic components on the at least one electronic assembly are isolated from the material used to form the housing. Further, the system includes an electrical connector coupled to at least one electronic component in the one or more electronic components, wherein the electrical connector provides an electrical connection between the at least one electronic assembly and system electronics that are outside the housing, wherein the electronic assembly is environmentally sealed within the housing from the environment outside the housing.

An electronic device includes a printed board, a frame for fixing the printed board, a connector fixed at a position along one side of a front surface of the printed board, and an electrically conductive member. An indented portion is formed at a position of the one side facing the connector. The electrically conductive member has a portion arranged in the indented portion, and is expanded and contracted in a direction along the one side and a thickness direction of the printed board by an external force. The electrically conductive member has an upper surface, a lower surface, and a side surface in contact, respectively, with a shell of the connector, one surface of the frame, at least one side-surface portion which is part of a portion forming the indented portion and extends along a direction crossing the one side. The electrically conductive member is electrically connected with a ground of the printed board via the side-surface portion.

A silicon circuit board substrate is utilized in an electronic device in place of conventional PCB motherboard. The silicon circuit board substrate is adhered to the back side of a display assembly to provide structural support for the substrate. The silicon circuit board substrate and the display assembly may be electrically connected via contact pads provided on the respective sides of the substrate and the display assembly that are connected together.

A power converter includes a tubular housing having an accommodation space, a first and a second openings. A power module is disposed in the accommodation space and includes a circuit board and a first fastening portion. A bottom cover is formed with a second fastening portion and first bumps, and the bottom cover is pre-positioned on the tubular housing through the second fastening portion engaged with the first fastening portion. A bottom cover is bonded to the first opening through melting the first bumps by ultrasonic welding. A power cable is inserted through the bottom cover and electrically connected to the circuit board. A power socket is coupled to the second opening.

Disclosed is an electronic device. The electronic device includes a sidewall structure that forms a surface of the electronic device and that includes a key area formed on the surface of the electronic device. The electronic device also includes an internal frame that is formed inside the electronic device and faces an inner surface of the sidewall structure. The electronic device further includes a sensor assembly disposed between the internal frame and the sidewall structure, at least part of the sensor assembly is aligned with the key area. The sensor assembly includes a sensor that senses a force applied to the key area, based on displacement of an inner surface of the key area. The sensor assembly also includes a support member having one surface supported on the sensor and an opposite surface supported on the internal frame.

Systems and methods for embedding electronics in a housing using additive manufacturing are provided. In certain embodiments, a system includes a housing made using an additive manufacturing process. The system also includes at least one electronics assembly that is embedded into the housing during the additive manufacturing process, wherein one or more electronic components on the at least one electronic assembly are isolated from the material used to form the housing. Further, the system includes an electrical connector coupled to at least one electronic component in the one or more electronic components, wherein the electrical connector provides an electrical connection between the at least one electronic assembly and system electronics that are outside the housing, wherein the electronic assembly is environmentally sealed within the housing from the environment outside the housing.