An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

An electronic device including: an electronic unit accommodated in a circuit housing and a molded body which surrounds the circuit housing. The molding compound has a cut-out that exposes the circuit housing, in which cut-out an identification that characterizes the electronic circuit is arranged.

An electronic unit including a plug assembly having at least one plug element comprising a plug base body having numerous plug pins, an assembly carrier printed circuit board, on which at least one electronic component is disposed, and is in electrical contact with at least one conductor path of the assembly carrier printed circuit board, a plug printed circuit board, onto which the plug assembly is attached, and is in electrical contact with at least one conductor path of the plug printed circuit board, and a cohesive cladding element, which seals the plug printed circuit board and at least one section of the assembly carrier printed circuit board against an external environment.

A control unit having a connection structure for connecting components of the control unit to a base plate which is cost effective, and facilitates heat transfer from a printed circuit board (PCB) to the base plate. The control unit includes circuitry mounted to a PCB, and the PCB is mounted to a base plate. The circuitry is over molded with epoxy material during manufacturing. The epoxy material flows between the PCB and the base plate, such that a layer of the epoxy is disposed between the PCB and the base plate. This layer of epoxy functions as a heat transfer layer, and a connection structure to connect the PCB to the base plate. The epoxy material transfers heat from the surface of the PCB in contact with the layer of epoxy to the surface of the base plate in contact with the layer of epoxy.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

A power module including a rigid-flexible PCB that exits from a resin molding case, and includes a first PCB region having a stacked structure of piled up layers; a second PCB region having said stacked structure, further locally delimited at a first side by a top stiffening element and at a second opposite side by a bottom stiffening element; and a third PCB region having said stacked structure without the top and bottom stiffening elements. The top and bottom stiffening elements extend at a lateral surface of the molding case, where the PCB exits from the molding case, and are configured to locally increase the rigidity of the PCB with respect to regions of the PCB 20 where said top and bottom stiffening elements are absent. A power module and method of manufacturing the power module is also provided.

Embodiments herein are directed to an assembly that includes a circuit board, a plurality of terminal pins, a first material layer, a second material layer, and a third material layer. The plurality of terminal pins extend from the circuit board. The first material layer encases a portion of the circuit board. The second material layer encapsulates a portion of the plurality of terminal pins and encases the first material layer. The second material layer defines a connector interface. A material of the second material layer is different from a material of the first material layer. The third material layer encases the first material layer and at least a portion of the second material layer. The third material layer defines a housing that is formed from a material different then the material of the first material layer and different from the material of the second material.

A control unit which meets desired packaging requirements, eliminates the need for right-angle or L-shaped pins, and has a reduced footprint. The control unit includes a connector, a circuit board connected to the connector, and an encapsulation housing. The encapsulation housing surrounds at least a portion of the circuit board and at least a portion of the connector. The connector includes a base flange, a shroud integrally formed with the base flange, a plurality of pins extending through the base flange and partially extending into the circuit board. The connector also includes at least one grounding pin connected to the base flange which partially extends into the circuit board. A bushing extends through a mounting post formed as part of the base flange such that the bushing is in contact with the grounding pin, where the grounding pin and the bushing are part of a grounding connection.

A sealed electronic antenna box includes: a rigid chassis having a first opening at one of the edges of the chassis; a rigid cover having a second opening at one of the edges of the cover; an electronic board having an antenna region close to one edge of the electronic board. The board mounted in the box such that an upper face of the antenna region faces the first opening in the chassis and a lower face of the antenna region faces the second opening in the cover. A cap engages an edge of the electronic board to cover the antenna region and the first and second openings. A seal overmolded on an external surface of the cap, extends along the free edges of the cap. When the cover and chassis are mounted on the electronic board, the seal is compressed against a surface of the chassis and the cover.

An electronic device includes a substrate and a plastic layer. The substrate has a first surface and a second surface opposite to each other; at least one of the first surface and the second surface is provided with an electronic assembly and a conducting wire; the conducting wire is electrically connected to the electronic assembly; the substrate further has a plurality of perforated holes; and the perforated holes extend to the second surface from the first surface. The plastic layer covers the first surface and the second surface, and fills in the perforated holes. Therefore, the electronic assemblies and the conducting wires can be arranged on both surfaces of the substrate, and the electronic assemblies on the first surface and the second surface both are protected by the plastic layer. In addition, also provided is a method to produce the electronic device.