An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.

The fitting structure for a conductive sheet of this invention comprises: a conductive member which is arranged within a predetermined region in a front case of an electronic device that has the front case and a rear case, said cases being first and second case pieces that are separably joined to each other, and which is electrically connected to ground patterns of the electronic device; and a conductive sheet which is arranged within the rear case so as to face the predetermined region of the front case and comprises a conductive layer. In a state where the front case and the rear case are joined with each other, the conductive layer of the conductive sheet is in contact with the conductive member and is electrically connected to the ground patterns of the electronic device.

The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

The present invention relates to the technical field of intelligent switches, and discloses an intelligent wall panel switch which can preset scene modes and is simple in operation, including a switch body and a controller arranged within the switch body, wherein the controller includes a single live wire power obtaining function module, a power management module, a Bluetooth module and a function key input module. The single live wire power obtaining function module is used for obtaining a voltage source input by a phase line, the power management module is used for receiving a stepped-down voltage, and the Bluetooth module is used for receiving a regulated voltage. The Bluetooth module establishes a wireless communication connection with LED lamps for receiving instruction information input by operation keys. The Bluetooth module correspondingly adjusts the scene mode of the LED lamps according to the instruction information.

An electronics device includes a folded printed circuit board which is folded about at least one fold region which defines a first section and a second section. A housing has a plurality of side portions. The first section of the folded printed circuit board is secured along an outer surface of a first side portion of the plurality of side portions. The housing further includes an interior. At least one first slot is defined within the interior and disposed along or near a second side portion arranged opposite the first side portion. At least one first pin member is disposed partly within the at least one first slot and extends therefrom. A distal end portion of the at least one first pin member engages with the second section of the folded printed circuit board so as to hold the second section in position over the interior of the housing.

The fitting structure for a conductive sheet of this invention comprises: a conductive member which is arranged within a predetermined region in a front case of an electronic device that has the front case and a rear case, said cases being first and second case pieces that are separably joined to each other, and which is electrically connected to ground patterns of the electronic device; and a conductive sheet which is arranged within the rear case so as to face the predetermined region of the front case and comprises a conductive layer. In a state where the front case and the rear case are joined with each other, the conductive layer of the conductive sheet is in contact with the conductive member and is electrically connected to the ground patterns of the electronic device.

An electronics device includes a folded printed circuit board which is folded about at least one fold region which defines a first section and a second section. A housing has a plurality of side portions. The first section of the folded printed circuit board is secured along an outer surface of a first side portion of the plurality of side portions. The housing further includes an interior. At least one first slot is defined within the interior and disposed along or near a second side portion arranged opposite the first side portion. At least one first pin member is disposed partly within the at least one first slot and extends therefrom. A distal end portion of the at least one first pin member engages with the second section of the folded printed circuit board so as to hold the second section in position over the interior of the housing.

A method of assembling a hermetically sealed printed circuit board includes: securing a flange of a cap against an electrical contact region on a first side of a substrate, the flange extending across a first end portion of a wall of the cap, the wall extending around the electrical contact region and including a second end portion disposed in an open configuration; and closing the second end portion of the wall to form a hermetically sealed chamber around the electrical contact region.

An electronic module includes a carrier element and a circuit board. The circuit board is attached in and/or to the carrier element via at least one connection site. The at least one connection site is formed by means of a hardenable medium.

A method of assembling a hermetically sealed printed circuit board includes: securing a flange of a cap against an electrical contact region on a first side of a substrate, the flange extending across a first end portion of a wall of the cap, the wall extending around the electrical contact region and including a second end portion disposed in an open configuration; and closing the second end portion of the wall to form a hermetically sealed chamber around the electrical contact region.