Patent classifications
H05K5/0047
Mobile terminal
The present disclosure discloses a mobile terminal, including a case forming a portion of an appearance; a circuit board disposed inside the case; a flexible printed circuit board electrically connected to the circuit board; a first connector mounted on the circuit board; a second connector mounted on the flexible printed circuit board and fastened to the first connector; and a first antenna having array elements mounted on the flexible printed circuit board, wherein the first antenna is disposed to face a side surface of the case to radiate beam-formed wireless signals through the side surface adjacent to one side of the circuit board.
MODULARIZED SMART INWALL SYSTEM
Disclosed is a modularized smart inwall system which allows different feature-enabled wall plates to be installed to an inwall unit, wherein one wall plate may be exchanged for another wall plate without requiring replacement of the entire system or removal of the inwall unit.
Electronic controller able to be expanded in a modular manner
A modularly expandable electronic control unit comprises: an electronic circuit board on which a conductor track is disposed on a side in a region of lateral edges and enclosing an inner region and separating it from an outer region of the side, a housing having two halves for receiving the electronic circuit board. With the housing assembled, at least one housing half has an encircling electrically conductive shielding wall which rests on and establishes electrical contact with the conductor track and/or has at least one receptacle accessible from outside the assembled housing. The receptacle is disposed so the electronic module placed in the receptacle may be electrically connected to a module connection port disposed in the outer region of the electronic circuit board. The electronic circuit board has electrical connections between the module connection port and one or more electronic assemblies disposed on the inner region.
Optical Communication Element
A COSA as an optical communication component that can prevent energy radiated in a package from causing performance degradation includes a DC block capacitor that is mounted on an upper surface of the package and located at a position different from those of a SiP chip and an optical modulator driver IC to cut off a DC signal included in a RF signal to be transmitted to the IC and a lid provided over an upper portion of the package. A separation projecting portion of the lid projecting toward an upper surface of the package separately defines a region where the capacitor is present and a region where the SiP chip and the IC are present. The separation projecting portion is connected to GND of the package, and the lid is at a GND potential.
Handheld electronic device
A portable electronic device includes a housing, a display at least partially within the housing, and a front cover and rear cover coupled to the housing. The rear cover defines a first portion of a rear exterior surface of the portable electronic device, a protrusion defining a sensor array region of the rear cover and a second portion of the rear exterior surface, and an internal surface opposite the second portion of the rear exterior surface. The portable electronic device also includes a sensor array mounted within the housing along the sensor array region and comprising a frame member coupled to the rear cover, a camera module positioned in the first container region, and a depth sensor module positioned in the second container region and attached to the internal surface of the rear cover.
PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE
A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly’s PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.
ELECTRICAL DEVICE
An electrical device includes a container, a conversion unit, an outer cover and an inner cover. The container is provided with an inner bottom surface and an inner which define an accommodating channel together. An inlet of the accommodating channel is opposite to the inner bottom surface. The conversion unit is disposed within the accommodating channel. The outer cover covers the inlet of the accommodating channel. The inner cover is disposed within the accommodating channel, and located between the conversion unit and the outer cover. One part of the conversion unit extends to the opening, and at least one outer edge of the inner cover is connected to an inner wall of the container.
Systems and methods for an enclosure that provides EMI shielding and heat sinking to an electronic assembly of a vehicle
Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.
HANDHELD ELECTRONIC DEVICE
A portable electronic device includes a housing, a display at least partially within the housing, and a front cover and rear cover coupled to the housing. The rear cover defines a first portion of a rear exterior surface of the portable electronic device, a protrusion defining a sensor array region of the rear cover and a second portion of the rear exterior surface, and an internal surface opposite the second portion of the rear exterior surface. The portable electronic device also includes a sensor array mounted within the housing along the sensor array region and comprising a frame member coupled to the rear cover, a camera module positioned in the first container region, and a depth sensor module positioned in the second container region and attached to the internal surface of the rear cover.
Handheld electronic device
A portable electronic device includes a front cover, a rear cover, and a housing structure between and coupled to the front cover and the rear cover. The housing structure includes a first housing member defining and a first interlock feature formed along a first end surface. The portable electronic device also includes a second housing member defining a second interlock feature formed along a second end surface. The portable electronic device also includes a nonconductive joining element engaged with the first interlock feature and the second interlock feature, thereby structurally coupling the first housing member to the second housing member.