A modularly expandable electronic control unit comprises: an electronic circuit board on which a conductor track is disposed on a side in a region of lateral edges and enclosing an inner region and separating it from an outer region of the side, a housing having two halves for receiving the electronic circuit board. With the housing assembled, at least one housing half has an encircling electrically conductive shielding wall which rests on and establishes electrical contact with the conductor track and/or has at least one receptacle accessible from outside the assembled housing. The receptacle is disposed so the electronic module placed in the receptacle may be electrically connected to a module connection port disposed in the outer region of the electronic circuit board. The electronic circuit board has electrical connections between the module connection port and one or more electronic assemblies disposed on the inner region.

Aspects of the present disclosure are presented for providing coordinated energy outputs of separate but connected modules, in some cases using communication protocols such as the Data Distribution Service standard (DDS). In some aspects, there is provided a communication circuit between a header or main device, a first module, and a second module, each including connection to a segment of a common backplane, where the output from a first module can be adjusted by sensing a parameter from a second module. In some aspects, the signal can pass from the first module through the header to the second module, or in other cases directly from the first module to the second module. Aspects of the present disclosure also include methods for automatically activating a bipolar surgical system in one or more of the modular systems using the DDS standard.

A method for controlling an output of an energy module of a modular energy system. The energy module can comprise a plurality of amplifiers configured to generate a drive signal at a frequency range and a plurality of ports coupled to the plurality of amplifiers. The method includes determining to which port of the plurality of ports the surgical instrument is connected, selectively coupling an amplifier of the plurality of amplifiers to the port of the plurality of ports to which the surgical instrument is connected, and controlling the amplifier to deliver the drive signal for driving the energy modality to the surgical instrument through the port.

A first module configured to engage with a second module in a stacked configuration to define a modular energy system is provided. The second module comprises a second bridge connector portion that comprises a second outer housing and a second electrical connection element. The first module comprises a first bridge connector portion comprising a first outer housing and a first electrical connection element. The first outer housing is configured to engage the second outer housing during assembly of the modular energy system prior to the first electrical connection element engaging the second electrical connection element.

An electronic control unit for a vehicle. The electronic control unit is defined by a housing comprising a cover, a base, a circuit board, a connector and a backup power supply, and means for mounting the cover to the base. A carrier is provided for supporting the backup power supply. The carrier is arranged inside the housing and mounted directly to the base.

A modular surgical system is disclosed includes a header module including a power supply, a first surgical module, a second surgical module, and a segmented power backplane. The first surgical module is arrangeable in a stack configuration with the header module and the second surgical module. The segmented power backplane includes a first backplane segment in the header module, a second backplane segment in the first surgical module, and a third backplane segment in the second surgical module. The second backplane segment is detachably coupled to the first backplane segment in the stack configuration and the third backplane segment is detachably coupled to the second backplane segment in the stack configuration. The first backplane segment, the second backplane segment, and the third backplane segment are configured to cooperate to transmit energy from the power supply to the second surgical module in the stack configuration.

An electronic device includes: a housing; a battery disposed in the housing; and a sensor module at least partially disposed in the housing, wherein the sensor module includes: a board; a biometric recognition sensor disposed on the board; a sealing member around at least a part of the board and at least part of the biometric recognition sensor, and a biosignal sensing electrode around at least a part of the sealing member, wherein the biosignal sensing electrode is electrically connected to the board and at least partially exposed outside of the housing.

A method for constructing a modular surgical system is disclosed. The method comprises providing a header module comprising a first power backplane segment, providing a surgical module comprising a second power backplane segment, assembling the header module and the surgical module to electrically couple the first power backplane segment and the second power backplane segment to each other to form a power backplane, and applying power to the surgical module through the power backplane.

An integrated device package is disclosed. The integrated device package can include a carrier that has an opening extending at least partially through a thickness of the carrier. The integrated device package can include a microelectronicmechanical systems die that is at least partially disposed in the opening and mechanically and electrically coupled to the carrier. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.

An integrated device package is disclosed. The integrated device package can include a printed circuit board and a microelectronicmechanical systems die that is at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board. The integrated device package can include a filler material that is at least partially disposed between the microelectronicmechanical systems die and the printed circuit board. The integrated device package can include a lid that is coupled to the printed circuit board. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.