Patent classifications
H05K5/0065
CONTROLLER FOR A VEHICLE COMPRISING AT LEAST ONE PRESSURE SENSOR ELEMENT
An electronic control unit for a vehicle, including: a pressure-sensor-element (PSE); a housing having a pressure-guide by which the PSE has a pressure-medium applied to it under pressure; an evaluation-unit to generate a pressure-signal, dependent on the pressure detected by the pressure-sensor-element in the pressure-guide; and a circuit-carrier on which at least part of control-electronics of the control-unit is arranged; the pressure-signal of the evaluation-unit being put in the control-electronics, the pressure-guide making direct contact with the circuit-carrier and a sealing-element arranged in the contact-region between the pressure-guide and the circuit-carrier, the sealing-element sealing a region of the pressure-guide to which the pressure-medium is applied under pressure from the surroundings, the PSE being arranged directly on the circuit-carrier, such that the PSE is arranged in the region of the pressure-guide to which the pressure-medium is applied under pressure, and the evaluation-unit being electrically directly connected to the circuit-carrier.
Electronic apparatus and housing unit that are equipped with housing member
An electronic apparatus which reduces radiation noise. A housing member mounted on a circuit board fixed to a casing houses a recording medium. A metal sheet member is electrically connected to the circuit board. The housing member has a recording medium connecting clock terminal that is connected to the recording medium housed in the housing member, and a board connecting clock terminal that is connected to the circuit board. The metal sheet member has a flat portion that faces the housing member across a predetermined space, and as seen in a direction perpendicular to a flat surface of the flat portion, an area of the flat portion which faces the board connecting clock terminal is opened.
ADAPTERS FOR ELECTRONIC CONTROL UNIT
An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.
Pressure bulkhead structure with integrated selective electronic switch circuitry
Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.
HIGH VOLTAGE POWER MODULE
A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function, and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.
MODULAR ELECTRICAL CIRCUIT CARRIER FOR VEHICLE LATCH AND VEHICLE LATCH WITH MODULAR ELECTRICAL CIRCUIT CARRIER
A modular electrical circuit carrier (ECC) configured to be directly secured to an exterior surface of a vehicle latch housing, the modular electrical circuit carrier (ECC) including: a housing; a printed circuit board located within the housing, the printed circuit board having a connector configured for securement with a wire harness connector and a series of connectors, wherein the printed circuit board includes a microprocessor capable of operating as a latch controller, wherein the housing and the series of connectors are configured for direct securement to the exterior surface of the vehicle latch housing.
Panel-molded electronic assemblies
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
STORAGE DEVICE AND INFORMATION PROCESSING DEVICE
According to one embodiment, a storage device is disclosed. The storage device includes a substrate, a first connector provided on the substrate and including a notch, and a nonvolatile memory provided on the substrate. The storage device further includes a first conductive part provided on the first connector and being adjacent to the notch.
DRIVER CIRCUIT DEVICE FOR DRIVING EXTERNAL DEVICE HAVING SEMICONDUCTOR ELEMENT
A gate driver includes: driver boards mountable on an IGBT module which is a driving-target external device; gate driver circuits which are formed on the driver boards and each apply a drive signal generated using power and a signal which are externally input through an input connector, to semiconductor elements of the IGBT module; and an insulating surrounding member disposed to surround a peripheral edge of the input-side driver board.
Adapters for electronic control unit
An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.