An electronic control device including a circuit substrate having a signal wiring and a ground wiring; at least one connector having a signal conductor and a ground conductor respectively connected to the signal wiring and the ground wiring of the circuit substrate on one end side and extending on the other end side; a housing including an accommodating portion that accommodates the circuit substrate and the at least one connector, in which a radio wave path through which a leakage electromagnetic wave propagates from one end on the circuit substrate side toward the other end on the side opposite to the circuit substrate side of the at least one connector is formed in an internal space at the periphery of the at least one connector; and a leakage electromagnetic wave attenuating structure provided between the housing and the at least one connector; where the leakage electromagnetic wave attenuating structure includes a plurality of conductors that are arrayed along a direction in which the leakage electromagnetic wave propagates from the one end of the at least one connector, and attenuate the leakage electromagnetic wave propagating through the radio wave path.

A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

A power module structure includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the fourth metal layer is connected to the second metal layer via a connecting bridge; at least one first switch including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.

A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

An electrical connection box is provided with a connector-attached board and a shield case that internally houses the connector-attached board. The connector-attached board is provided with a circuit board, a connector that is fixed to the circuit board and that engages with a mating connector, and an attachment that is attached to the connector. The shield case surrounds the circuit board and is provided with an upper short wall portion and a lower short wall portion that include a connector opening for facing the connector outside. The attachment is provided with a waterproof portion that covers the periphery of an engagement surface of the connector that faces the mating connector, and the waterproof portion is provided with a waterproof wall that covers the periphery of the connector and the mating connector.

The present disclosure relates to the technical field of display, and discloses a display device. The display device includes: a display module having a module body and a first bonding portion located on one side of a first long edge of the module body, where the first bonding portion is bent to the back face of the module body; and a first flexible printed circuit located on the back face of the module body, where the first flexible printed circuit has a second bonding portion, and the second bonding portion is fixedly connected to the first bonding portion of the display module; the length of the second bonding portion along an extending direction of the first long edge is substantially identical with the length of the first bonding portion along the extending direction of the first long edge.

An electronic equipment assembly has an interconnect including columns of signal conductors, connectors mounted to the columns of signal conductors, and a chassis coupled with the interconnect. The chassis provides slots that guide resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices. At least one column of the columns of signal conductors of the interconnect is a multi-function column. Each multi-function column is constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column.

A reconfigurable electrical box includes an enclosure, and an electrical component arranged within the enclosure. A plurality of base contacts are arranged within the enclosure and are electrically connected to the electrical component, and a plurality of external contacts are arranged over and selectively conductively connected to a portion of the plurality of base contacts. A frame is fitted over the plurality of external contacts and is attached to the enclosure. The frame fixes the position of the external contacts relative to the plurality of base contacts.

A new and improved intrinsically safe barrier (“ISB”) provides advantages in connection with installation of field equipment in hazardous areas including Division 2/Zone 2 areas. In one embodiment the new ISB provides a pluggable/unpluggable ISB for use with a receiving terminal base adapted for individual field mounting and alternatively for use with a circuit mount terminal base to permit direct mounting of ISB on circuit boards. A highly effective heat sink design and potting material allows for heat dissipation to allow the ISB to serve a wider range of applications.

An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.