The present invention provides an electronic component housing comprising: a first housing; a second housing; a sealing member positioned between the first housing and the second housing; and a fixing member for fixing the first housing to the second housing, wherein the sealing member penetrates the first housing so as to be insert-injected therein.

The maximum value of the reaction force generated on the circuit substrate can be reduced. An electronic control device includes a cover having a hollow opening; a connector inserted into the opening; and a seal member having compressibility that is arranged in contact with a first position of an inner peripheral portion of the opening and that comes into close contact with the inner peripheral portion of the opening and the connector in a compressed state; where the opening has a thickness in a first direction penetrating through the hollow of the opening; an area of a hollow region which is a hollow region of the opening is reduced or maintained along the first direction; the seal member is arranged on an outer peripheral portion of the connector and inserted in the first direction to the opening together with the connector; and an area of the hollow region at the first position is smaller than an area of the hollow region at an entrance of the opening in the first direction.

A floating bearing bush for bearing a printed circuit board includes a bearing ring and a soldering ring. The bearing ring includes a tubular opening for receiving a fastening bolt. The soldering ring surrounds the bearing ring and is configured to be soldered by a lower edge onto a printed circuit board. The lower edge of the soldering ring is provided by a continuous wall which is configured to keep a liquid potting compound away from the interior of the soldering ring. The bearing ring is movably suspended within the soldering ring, with the result that the bearing ring is movable at least in a radial direction with respect to the soldering ring.

An electrical assembly includes a printed circuit board substrate, at least one electrical component which is arranged on the printed circuit board substrate and with which the printed circuit board substrate makes electrical contact, a protective cap which is arranged above the electrical component, and a sheathing material which is applied to the printed circuit board substrate over the protective cap and which covers at least the protective cap on the outside in such a way that the protective cap is provided with at least one filling opening. The sheathing material is introduced through the at least one filling opening into a cap interior between the protective cap and the printed circuit board substrate in such a way that a clearance, which is not filled with the sheathing material and which directly adjoins the at least one electrical component, remains between the protective cap and the printed circuit board substrate.

An electronics module for a transmission control unit may including one or more of the following: a printed circuit board populated with electronic components that are attached to an upper surface and/or a lower surface of the printed circuit board, and electrically connected thereto, and a media-tight protective layer, which covers one or more electronic components and connecting points between the one or more electronic components and the printed circuit board, where there is a cooling element for cooling the electronic components on one side of the printed circuit board, where the cooling element is connected to the printed circuit board and houses the electronic components that are to be cooled, and where the media-tight protective layer covers a transition region between the printed circuit board and the cooling element along the entire periphery of the cooling element.

A sensor dome arrangement has a sensor dome and a housing wall, which is particularly a transmission wall. The sensor dome includes a sensor, dome contacts which are electrically connected to the sensor, and a dome housing. The dome housing has a first dome housing section in which the sensor is arranged, and a second dome housing section on or in which the dome contacts are arranged. A through-opening is made in the housing wall, and the sensor dome is attached to the housing wall such that at least one outer surface of the first dome housing section faces a first chamber which is adjacent to the sensor dome and an inner side of the housing wall, and such that the dome contacts face a second chamber which is adjacent to the sensor dome and an outer side of the housing wall.

The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

A control box includes a housing defining an interior, the housing including a cover and a stiffener, the stiffener removably connected in contact with the cover, the stiffener including an outer frame and at least one cross-member. The control box further includes a heat sink removably connected in contact with the stiffener. The control box further includes a first circuit board disposed within the interior, the first circuit board positioned between the stiffener and the heat sink, and a second circuit board disposed within the interior, the second circuit board positioned between the cover and the stiffener. The cover, stiffener, and heat sink are stacked along a transverse direction.

The maximum value of the reaction force generated on the circuit substrate can be reduced.

An electronic control device includes a cover having a hollow opening; a connector inserted into the opening; and a seal member having compressibility that is arranged in contact with a first position of an inner peripheral portion of the opening and that comes into close contact with the inner peripheral portion of the opening and the connector in a compressed state; where the opening has a thickness in a first direction penetrating through the hollow of the opening; an area of a hollow region which is a hollow region of the opening is reduced or maintained along the first direction; the seal member is arranged on an outer peripheral portion of the connector and inserted in the first direction to the opening together with the connector; and an area of the hollow region at the first position is smaller than an area of the hollow region at an entrance of the opening in the first direction.

An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.