A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.

A sealing interface (26) that utilizes an elastomeric sealing member (28) is disclosed herein. The sealing interface (26) is configured to provide effective sealing while requiring only relatively low amounts of force to deform the elastomeric sealing member (28) sufficiently to form an effective seal.

A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

An electronic device comprising: a first case in which a groove is arranged along an outer circumference; a second case that overlaps with the first case and that has a rib extending toward a bottom face of the groove; and a seal member that is sandwiched between the bottom face and the rib, wherein the groove includes: a first side wall that is arranged on one end portion of the bottom face; and a second side wall that is arranged on other end portion of the bottom face, a height of the first side wall from the bottom face is lower than a height of the second side wall, and the first side wall does not come into contact with the second case.

A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).

Provided is a washing machine having a printed circuit board (PCB) assembly. The washing machine includes a cabinet forming an external appearance thereof, a top cover coupled to an upper side of the cabinet, and a PCB assembly provided in the cabinet and configured to control the washing machine, wherein the PCB assemble includes a frame in which a PCB is accommodated and a cover covering the PCB, and the cover includes a heat dissipation path configured to dissipate heat of the PCB and a water inflow preventer configured to prevent water from being introduced into the heat dissipation path.

A method for producing a hermetically gastight optoelectronic or electro-optical component with great robustness to heat and moisture is described. A housing cap is connected to a carrier in a hermetically gastight manner. Orifices in the housing cap are closed in a hermetically gastight manner by a window element. An electronic component with a housing has a housing cap, a carrier as base plate of the housing, and an interior space enclosed by the housing cap and the carrier. An optoelectronic or electro-optical converter element is arranged in the interior space. The housing cap is closed in a hermetically gastight manner by the carrier through a bonding connection of fused metal. The orifice is connected to the housing cap in a hermetically gastight manner by a window element along an edge metallization of the window element by a circumferential first seam of a fused metallic material.

A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.