A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.

The present disclosure relates to a waterproofing method for an electronic device. In one example method, silane is coated on an inner wall of a first housing of the electronic device and an inner wall of a second housing of the electronic device. The first and second housings and a main board of the electronic device are assembled. Fluoride is injected into a cavity of the electronic device through a liquid inlet hole on the first housing. An integral continuous waterproofing membrane is formed on the inner walls of the first and second housings through chemical reaction between the silane and the fluoride.

An electronic device and method are disclosed. The electronic device includes a housing comprising at least one electronic component disposed within the electronic device, a first separation member configured to separate a first cavity at least partially exposed to an exterior of the electronic device through the housing from a second cavity in which the at least one electronic component is disposed; and a driver disposed in a third cavity spatially coupled with the second cavity in an interior of the housing, the driver configured to generate an air pressure differential between the second cavity and the first cavity. The method operates the device responsive to detecting a water immersion condition by outputting a sound by a speaker device, detecting the outputted sound through a microphone device, determining whether the detected sound matches a predetermined reference value and if so, operating a driver device to discharge the residual water.

An over-the-air measurement chamber is provided for performing measurements with respect to a device under test. The over-the-air measurement chamber includes a thermally isolated space inside the over-the-air measurement chamber, a positioner for positioning the device under test, and a first gas guiding means for intake of a gas and a second gas guiding means for outtake of the gas. The positioner comprises an inner portion and an outer rotational unit. The first and second gas guiding means are fed into the inner portion of the positioner through a hollow rotational axis of the outer rotational unit.

An electric component assembly includes a housing with which an electric component is fitted together, and the electric component and the housing are fixed to one side of a base body. The electric component includes a connecting terminal configured to be press-fitted in a through-hole of the control board of the housing, and a direction in which the connecting terminal is inserted into the through-hole is same as a fitting direction relative to the housing. There are provided a rib protruding from one of the electric component and the housing, and a groove portion recessed from another one of the electric component and the housing and into which the rib is press-fitted. Movement of the electric component in a direction intersecting the fitting direction and rotation of the electric component around an axis parallel to the fitting direction are restrained by the rib press-fitted into the groove portion.

A surge protective device (SPD) assembly module includes a polymeric outer enclosure, an SPD module, a first terminal, and a second terminal. The polymeric outer enclosure defines an enclosed, environmentally sealed enclosure chamber. The SPD module is disposed in the enclosure chamber. The SPD module defines an environmentally sealed SPD chamber and includes: first and second electrically conductive electrode members; and a varistor member formed of a varistor material and electrically connected between the first and second electrode members. The varistor member is disposed in the SPD chamber between the first and second electrode members. The first terminal is electrically connected to the first electrode member and extending out from the outer enclosure. The second terminal is electrically connected to the second electrode member and extending out from the outer enclosure.

An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. Anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.

A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.