An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate. The internal ground plate is electrically connected to the ground metallization of the chip capacitor and to either the ferrule or the ground pin connected to the ferrule. An active electrical path extends between the active metallization of the chip capacitor and the lead wire.

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.

A micro speaker assembly including a speaker enclosure having an enclosure wall separating a surrounding environment from an encased space, wherein the enclosure wall defines, in part, an acoustic channel that acoustically couples the encased space to the surrounding environment, and the enclosure wall comprises a chemically etched insert molded metal portion that is mechanically interlocked and hermetically sealed to a plastic portion. The micro speaker further including a speaker assembly positioned within the encased space, the speaker assembly having a sound radiating surface facing the metal portion of the enclosure wall, a voice coil extending from the sound radiating surface, a magnet assembly having a magnetic gap aligned with the voice coil, and an acoustic chamber formed, in part, by the metal portion of the enclosure wall and the sound radiating surface.

Various embodiments of the present disclosure may include a device comprising a vacuum package housing. The vacuum package housing comprises a base and a plurality of walls connected to the base and defining an interior cavity adapted to receive a focal plane array, wherein at least two of the walls meet to define a corner of the vacuum package housing. The vacuum package housing further comprises an aperture formed at the corner, wherein the aperture extends through the at least two of the walls to provide a channel between the interior cavity of the vacuum package and an external environment, and wherein the aperture is adapted to receive a tip-off tube configured to be changed from an open state to a closed state to maintain a vacuum within the interior cavity.

An apparatus includes an upper housing, a gasket, and a lower housing. The upper housing generally comprises a plurality of tabs and a plurality of threaded sockets. The lower housing generally comprises a plurality of openings configured to engage the tabs of the upper housing and a plurality of holes configured to align with the plurality of threaded sockets when assembled to the upper housing.

A sealing interface (26) that utilizes an elastomeric sealing member (28) is disclosed herein. The sealing interface (26) is configured to provide effective sealing while requiring only relatively low amounts of force to deform the elastomeric sealing member (28) sufficiently to form an effective seal.

Embodiments are provided that enable an implantable connector, along with related apparatuses, devices, systems, methods, computing devices, computing entities, and/or the like to serve patients with neural interfaces requiring connectors with higher channel densities (>0.05 ch/mm.sup.3) or higher channel counts (>32) than is practical with conventional implant-connector technology.

A mobile terminal includes a display unit; a front window arranged in front of the display unit; a frame arranged behind the display unit; and a waterproof member arranged between an edge of the front window and an edge of the frame forming a closed loop and forming a sealed space between the front window and the frame by forming a looped curve, wherein the water proof member comprises a start portion, an end portion and the looped curve between the start portion and the end portion, the start portion and the end portion are bent toward the inside of the looped curve.

A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.