An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

A sealing interface (26) that utilizes an elastomeric sealing member (28) is disclosed herein. The sealing interface (26) is configured to provide effective sealing while requiring only relatively low amounts of force to deform the elastomeric sealing member (28) sufficiently to form an effective seal.

A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).

There is disclosed a mobile terminal comprising a display unit comprising a first flat area and a second flat area provided adjacent to at least predetermined portion of the first flat area; a front window arranged in front of the display unit and comprising a second flat area and a second curved area provided adjacent to at least predetermined portion of the second flat area; a frame arranged behind the display unit and comprising a third flat area with the same right-and-left width to the first flat area and a third curved area provided adjacent to at least predetermined portion of the third flat area; an adhesive member arranged between the first flat area and the third flat area and configured to bondingly couple the display unit and the frame to each other; and a waterproof member provided on an outer surface of the adhesive member and configured to close a space formed between the front window and the frame by forming a looped curve between an edge of the front window and an edge of the frame, wherein at least predetermined portion of each of the second and third curved areas is overlapped with the first curved area, and at least predetermined portion of the waterproof member is provided between an outer end of the second curved area and an outer end of the third curved area, and the waterproof member divides the space formed between the front window and the frame into a closed inner space and a closed outer space, and a back-and-forth gap between the front window and the frame in the closed inner space is larger than a back-and-forth gap between the front window and the frame in the closed outer space.

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. Anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

One aspect relates to an apparatus includes a ceramic body including a first surface and a further surface. The first surface is opposite the further surface, the first surface includes a first opening. The further surface includes a further opening. The first opening and the further opening are connected by a tunnel, which at least partly includes a tunnel filling and is occluded by the tunnel filling. The tunnel filling includes a first constituent, including a cermet, and a second constituent. The first and second constituents are electroconductingly connected to one another. The first constituent has a first electrical conductivity and the second constituent has a second electrical conductivity, which differs from the first by at least 5.Math.10.sup.?4 Siemens per meter (S/m). The ceramic body is characterized by a further electrical conductivity. The first electrical conductivity is more by at least 1.Math.10.sup.5 Siemens per meter (S/m) than the 15 further electrical conductivity.

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. Anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

This disclosure describes a portable electronic device that includes a first housing component having an exterior-facing surface and an interior-facing surface; and a second housing component cooperating with the first housing component to define an interior volume. A seal fills an interface between the first and second housing components. Electrically conductive material that forms an electrically conductive pathway extends across portions of the interior and exterior-facing surfaces of the first housing component. The electrically conductive pathway is configured to transmit and/or receive signals or power between an exterior and interior of the portable electronic device.

A micro speaker assembly including a speaker enclosure having an enclosure wall separating a surrounding environment from an encased space, wherein the enclosure wall defines, in part, an acoustic channel that acoustically couples the encased space to the surrounding environment, and the enclosure wall comprises a chemically etched insert molded metal portion that is mechanically interlocked and hermetically sealed to a plastic portion. The micro speaker further including a speaker assembly positioned within the encased space, the speaker assembly having a sound radiating surface facing the metal portion of the enclosure wall, a voice coil extending from the sound radiating surface, a magnet assembly having a magnetic gap aligned with the voice coil, and an acoustic chamber formed, in part, by the metal portion of the enclosure wall and the sound radiating surface.

One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.