A housing of an electronic device includes a substrate defining an external surface and internal surface of the housing, at least one sidewall extending from the substrate, and abrasion-resistant members at least partly embedded in the substrate and extending beyond the external surface. The abrasion-resistant members may be formed from metal or ceramic. The substrate comprises a moldable matrix. The abrasion-resistant members are harder than the moldable matrix.

Motor control centers have units or buckets with an extendable/retractable power connection (stab) assembly and one or more operating lever interlocks that include a unit latch to latch to a cabinet and a power connection position interlock that blocks the handle of the units or buckets based on position of the power connection assembly, optionally also including a shutter cam that slides a shutter right and left.

An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.

This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

A secure electronic device with matching disassembling tool includes a housing and an electronic element. The disassembling tool includes a securing member, a first elastic disassembling member, and a second disassembling member. The securing member is mounted to the housing. The securing member includes an elastic locking block locked to the electronic element. The first elastic disassembling member can reach and be inserted into the securing member. The second disassembling member is inserted in the first disassembling member. When the second disassembling member is then rotated, the first disassembling member is deformed to press the elastic locking block, which unlocks from the electronic element.

A security device comprises a housing assembly comprising a mounting bracket and a main housing detachably mountable to the mounting bracket. The housing assembly has a closed configuration that can be at least partially opened using a first mechanism. When the housing assembly is at least partially opened, a second mechanism is accessible to be manipulated to enable movement of the main housing with respect to the mounting bracket. In the closed configuration the second mechanism prevents movement of the main housing with respect to the mounting bracket and is inaccessible to thereby prevent said manipulation. A method of retaining a main housing of a security device on a mounting bracket when inserting a further housing component into engagement with the main housing is also disclosed.

An industrial control system module and methods are described for self-destruction or the destruction and/or erasure of sensitive data within the industrial control system module upon an indication of an unauthorized module access event. In an implementation, a secure industrial control system module includes a circuit board including electrical circuitry; a sealed encasement that houses the circuit board, where the sealed encasement includes a housing having a first housing side and a second housing side, where the housing is configured to house the circuit board when the first housing side and the second housing side are coupled together; and a first sensor component integrated with the sealed encasement, where the first sensor component is communicably coupled to the circuit board and electrical circuitry and is configured to provide an indication of an unauthorized access event.

Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.

A structural subassembly for use in an information handling system chassis may include a first portion, a second portion, a common wall, and one or more mechanical features. The first portion may be configured to receive one or more of a first type of information handling resource. The second portion may be configured to receive one or more of a second type of information handling resource. The common wall may divide the first portion from the second portion. The one or more mechanical features may be configured to engage with one or more respective mechanical features of the information handling system chassis in order to perform at least one of guiding of the subassembly relative to the information handling system chassis during insertion or removal of the subassembly into or from the information handling system chassis and retention of the subassembly relative to the information handling system chassis.

Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.