A data acquisition module is disclosed for use with electronic components such as superconductive magnets wherein the electronic components and the data acquisition module may reside inside a cryostat. The data acquisition module allows conventional electronic technologies to work inside cryostats at cryogenic temperatures as low as 4 K. This is achieved by management of heat inside the module to keep the module operating at a temperature above the cryogenic temperature. This approach avoids the difficulties that arise from changes in carrier mobility in semiconductors operating at deep cryogenic temperatures. A cryogenic system comprises a cryostat containing a cryogenic fluid and at least one sensor, and a data acquisition module located within the cryostat, the module in communication with the at least one sensor to acquire data, wherein the module comprises a thermal package, a conditioning and digitizing electronic module, a controller module, a power module, and a thermal management module.

A circuit assembly that dissipates heat with improved efficiency compared to a conventional structure while securing waterproofing is disclosed. The circuit assembly includes a case including an opening hole in a bottom portion thereof, a heat generating component that is housed inside the case, is exposed to the outside from the opening hole, and is in thermal contact with an external heat dissipator, and an annular sealing member that is disposed at a peripheral edge portion of the opening hole and is interposed between the case and an attached member that is attached to the case.

A sunshield can protect internal componentry against temperature fluctuation rates. The shield can include a housing. The housing can include two similar halves. Each half can include a vertical wall with two vertical edges. The vertical edges of one half can be configured to mate, directly or indirectly, with the vertical edges of the other half to form a single unit. The single unit can be shaped to correspond with the exterior shape of the internal componentry. The shield can have an air gap between the vertical walls and the internal componentry.

A system configured to provide thermal regulation and vibration isolation to one or more electronic components. The system includes a sensor chassis defining an interior chamber, an electronics housing in the interior chamber of the sensor chassis, a thermoelectric cooler coupled between the sensor chassis and the electronics housing, a thermal strap coupled to the sensor chassis, and at least one isolator coupled to the sensor chassis. The system may also include an insulating material, such as Aerogel, in the interior chamber of the sensor chassis and extending around the electronics housing.

A housing that can be provided on the inside with a lining, made of an open-pore material and preferably covering at least two sides of the housing, for the reduction of internal explosion pressure. In addition, or alternatively, a molded body made of the open-pore material, in particular a bonded fiber material, can be arranged in the housing. Methods are used to provide an assembly of an open-pore material and a flameproof body in order to create an assembly that has a higher temperature class and/or a higher flameproofing class than those for which the flameproof body is designed.

Devices and methods for detecting and reporting a battery tamper event with regard to an intrinsically-safe or explosion-proof device while the device is located in a hazardous environment. The device may include a location sensor for determining that the device is in a hazardous location. While in the hazardous location, the device may detect an open enclosure event using a sensor and, if so, it may monitor for detection of a battery tampering event. The battery tampering event may include battery replacement or battery charging. The battery tamper event may be reported to a remote server over a wireless channel when it occurs.

A housing contains an internal volume. A heat-sensitive device is contained by the housing and consumes a device percentage of the internal volume. The device percentage equals the percentage of the internal volume of the housing consumed by the heat-sensitive device. A phase-change material is positioned within the housing to conduct heat from the heat-sensitive device. The phase-change material consumes a percentage of the internal volume equal to 100 percent minus the device percentage minus an expansion percentage. The phase-change material expands in volume by an amount more than 75 percent of the expansion percentage upon occurrence of a phase-change event.

An apparatus for thermal management and protection from moisture for an electronic device is described. The apparatus comprises an internal enclosure insert containing a printed circuit board (PCB) populated with at least one electrical component; a back plate coupled to the internal enclosure insert, wherein the back plate is coupled along an internal surface to at least one electrical component on the PCB; and a thermal radiation shield coupled to and surrounding the internal enclosure insert, at least one portion of the thermal radiation shield being separated from the internal enclosure insert by at least one air gap. When affixed to a mounting surface, at least one air gap is formed between the thermal radiation shield and the mounting surface.

A heat insulation sheet includes: a heat insulation layer formed as a nanofiber web form having a plurality of pores by electrospinning a polymeric material; and an adhesion layer laminated on one or both sides of the heat insulation layer and formed as a nanofiber web form by electrospinning an adhesion material, to thereby be made thin and have a plurality of fine pores, and to thus improve heat insulation performance.

A apparatus for securing a shield body to one or more enclosures can include a plurality of mounting members configured to retain a plurality of fasteners at any of a plurality of locations along the mounting members. A first set of the mounting members can be secured to a second set of the mounting members, using a first set of the fasteners, at any of a plurality of locations along the mounting members of the first set. One or more enclosures can be secured to the second set of the mounting members, using a second set of the fasteners, at any of a plurality of locations along the mounting members of the second set.