An object of the present invention is to provide an electronic control unit that curbs overflow of a sealant at a three-way junction of the sealant in the vicinity of a connector. The electronic control unit includes a first seal part 51 that seals between a base member 40 and a cover member 30, a second seal part 52 that seals between the base member 40 and a connector housing 20, and a third seal part 53 that is connected to the first seal part 51 and the second seal part 52 and seals between the cover member 30 and the connector housing 20. In a part (three-way junction) where the first seal part 51, the second seal part 52, and the third seal part 53 intersect, a space part 41JA1 that is connected to the recessed part 41 and recessed further from a surface forming the recessed part 41 is formed.

An electronic assembly, including an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto the sections of the adjoining casing parts abutting the gap region and bridges the gap region.

A housing for an electronic circuit configuration includes a housing seal disposed on an inner surface of the housing, integrally bonded to at least one outer housing wall and made of a liquid silicone elastomer. An electrical connecting element extends from the interior of the housing through an outer housing wall and out of the housing. A space between the outer housing wall and the electrical connecting element is sealed by the housing seal.

A peripheral wall includes a first peripheral wall edge portion and a second peripheral wall edge portion, which are disposed on a case member bottom surface so as to be distant from each other. A connector member main unit is disposed in a space between the first and second peripheral wall edge portions. A peripheral wall groove, which is open toward the connector member main unit, is disposed in each of the first and second peripheral wall edge portions. A bottom surface of the peripheral wall groove is inclined with respect to the case member bottom surface. A base plate groove is disposed on the bottom surface of the case member. A seal material is filled into the space formed between each of an inner surface of the peripheral wall groove and an inner surface of the base plate groove, and the connector member.

A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.

A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber.

Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having at least one functional group capable of crosslinking, (b) a functionalized extender, and (c) heat, and reacting the base polymer and functionalized extender in the presence of the heat to form the hybrid thermoplastic gel. The gel composition may comprise 5-40 wt % of a base polymer, 60-95 wt % of a functionalized extender, and 0-10 wt % of a crosslinker. A closure or interconnect system may comprise a housing, a cable, and a hybrid thermoplastic gel or sealant. A telecommunications apparatus may comprise a telecommunications component and a sealant that forms a seal with the telecommunications component. The sealant may comprise a sealant material having a first range of elongation followed by a second range of elongation.

According to an embodiment of the disclosure, an electronic device includes: a transparent front surface plate defining at least a portion of a front surface of the electronic device, and including a first edge and a second edge disposed on opposite sides, a third edge connecting one end of the first edge and one end of the second edge, and a fourth edge connecting another end of the first edge and another end of the second edge and disposed opposite the third edge; a rear surface plate defining at least a portion of a rear surface of the electronic device; a side housing surrounding at least a portion of a space between the front surface plate and the rear surface plate; a support disposed in the space and connected with the side housing or integrally formed with the side housing; a display disposed in the space and viewable through at least a portion of the front surface plate; a second flexible printed circuit board (FPCB) disposed to at least partially overlap the display when viewed above the front surface plate; a first FPCB connecting the display and the second FPCB, and disposed in a folded state within a specified proximity of the fourth edge and having a portion overlapping the display when viewed above the front surface plate; a first seal disposed between the first FPCB and the support, or between the second FPCB and the support, and extending from a first end to a second end along the fourth edge; a second seal disposed between the display and the support, and extending from a third end proximate the first end to a fourth end proximate the second end along the first edge, the third edge, and the second edge; and a third seal disposed between the first end of the first seal and the third end of the second seal, and between the second end of the first seal and the fourth end of the second seal, and connecting the first seal and the second seal.

In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected. For these reasons, an object to be achieved by the invention is that the semiconductor element can be cooled from both surfaces by alternately arranging the semiconductor component having the incorporated semiconductor element and the cooling device. The above-described object can be achieved as follows. A substantially rectangular thin plate is subjected to mountain bending and valley bending so as to form a shape having as many recesses as the number of the mounted semiconductor components having the incorporated semiconductor element. Concurrently, a lateral side in a direction orthogonal to the above-described bending direction is bent so as to dispose the case in which all edges configuring an outer shape of the thin plate are arranged on substantially the same plane. The semiconductor component having the incorporated semiconductor element is arranged at a position serving as the recess of the case. The cooling devices are arranged so as to interpose the semiconductor component having the incorporated semiconductor element via the case. The semiconductor component having the incorporated semiconductor element is sealed with a silicone gel. In addition, preferably, the case is configured to include metal which has high heat conductivity. More preferably, the case is configured to include aluminum, copper, or an alloy whose principal components are both of these.

A structure includes a sheet metal antenna as a first member, a rear-surface-side housing as a second member including a through hole, and a sealing portion which seals the through hole. The second member includes a space. The sheet metal antenna includes an intermediate portion as a pass-through portion which passes through the space and the through hole. The space includes a first region, a second region located opposite to the first region with the intermediate portion being interposed, and a third region which lies from one main surface of the intermediate portion to the other main surface thereof while it is in contact with both of the first region and the second region, and the second member includes an injection path as a groove continuing to the first region.