A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber.

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

A device includes a joining partner, which protrudes at a submersion depth into a recess filled at least partially with a fixing element in a substrate surface of a substrate. A compensating element is situated between the joining partner and the fixing element. The compensating element is situated at least partially in the fixing element within the submersion depth of the joining partner. Accordingly, the compensating element is in contact with the joining partner and with the fixing element. In this way, an expansion change or a movement of the fixing element, of the substrate or of the joining partner may be compensated for by a compression or elongation of the compensating element. A crack formation may be avoided or its effect may be minimized by the sealing function.

A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

The present disclosure relates to a waterproofing method for an electronic device. In one example method, silane is coated on an inner wall of a first housing of the electronic device and an inner wall of a second housing of the electronic device. The first and second housings and a main board of the electronic device are assembled. Fluoride is injected into a cavity of the electronic device through a liquid inlet hole on the first housing. An integral continuous waterproofing membrane is formed on the inner walls of the first and second housings through chemical reaction between the silane and the fluoride.

A sealing mechanism is provided, including a housing, a groove, and a sealing element. The housing includes a first member and a second member, and the groove is formed between the first and second members. The sealing element is formed in the groove by Low Pressure Molding (LPM) and surrounds at least one of the first and second members.

Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material.

The first annular sealing material is filled and applied between a first sealing surface provided on an outer peripheral part of the case and a second sealing surface provided on an outer peripheral part of the cover, a second annular sealing material is filled and applied between a first fitting member provided at the opening of the sealed housing and a second fitting member provided at the outer periphery of the body of the connector housing, a terminal part sealing material is applied to a connection surface which is an inner surface of the wall for partitioning inside and outside of the connector housing and is connected to the circuit substrate, the case and the cover are fastened together by a fastening member, the hermetically sealed housing is provided with a sealable ventilation passage that communicates the inside of the hermetically sealed housing with outside air.

A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber.