A landscape lighting junction device includes a junction body having a first portion and a second portion connectable together in a closed position defining an interior cavity. The junction device may further include a terminal block disposed in the junction body to facilitate the electrical connection of a power source to at least one lighting fixture. The junction device may further include a predetermined amount of viscous sealant disposed in the junction body.

In implementations of device component exposure protection, a computing device includes device components enclosed within a housing. The device components are assembled within the housing and enclosed within the housing upon completion of assembly of the computing device. The computing device further includes a protective material contained within the housing, which fills void spaces around the device components. The protective material prevents exposure of the device components to external matter that the computing device is exposed to upon completion of the assembly.

Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

Embodiments are directed to a circuit assembly for an electronic device having an electromagnetic shield that defines a sensing element or contact pad along an outer surface of the assembly. The circuit assembly includes a group of electrical components attached to a surface of a printed circuit board. A molded structure may encapsulate the group of electrical components and at least a portion of the surface of the printed circuit board. A metal layer may be formed over an outer surface of the molded structure. The metal layer may define both a shield portion configured to provide shielding for one or more of the group of electrical components and an electrode configured to detect an input applied to the electronic device.

In implementations of device component exposure protection, a computing device includes device components enclosed within a housing. The device components are assembled within the housing and enclosed within the housing upon completion of assembly of the computing device. The computing device further includes a protective material contained within the housing, which fills void spaces around the device components. The protective material prevents exposure of the device components to external matter that the computing device is exposed to upon completion of the assembly.

Systems (100) and methods (2400) for operating a submersible switch positioned below a body of water's surface. The methods comprise: deflecting a semi-rigid top wall of the submersible switch's cap towards a center of the switch when hydrostatic pressure is applied thereto; directly applying a pushing force by the submersible switch's cap onto an actuator of an internal switch disposed in a body of the submersible switch; and causing an operational state change of the submersible switch in response to the pushing force being applied directly to the actuator of the internal switch.

A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

An electronic unit for a missile comprising a potted electronics in a housing: the unit being adapted to compensate for a difference in coefficient of thermal expansion between the potted electronics and the housing, the unit further comprising: a first ramp; and a second ramp slidably arranged against the first ramp, wherein the first and second ramps are disposed within the housing, the first or the second ramp abutting the potted electronics so as to provide an interference fit between the potted electronics and the housing; wherein the first ramp and second ramp each comprise a coefficient of thermal expansion selected to maintain the interference fit between the potted electronics and the housing throughout a temperature range.

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. Anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

An electrical connection box includes a box main body having an opening portion in an upper end portion at a time of installation, and an upper cover that blocks the opening portion at the time of installation. The box main body has an insertion wall portion continuously formed along an outer circumference of the box main body in the upper end portion at the outer circumference of the box main body. The upper cover has a groove portion continuously formed along an outer circumference of the upper cover in a lower end portion at the outer circumference of the upper cover. Here, the insertion wall portion is inserted into the groove portion from lower side when the opening portion of the box main body is blocked. At least one rib protruding downward from a bottom portion of the groove portion is formed in the groove portion.