An electronic device includes an FPC as an extending member which extends to connect a first region and a second region to each other and includes a first surface and a second surface facing away from each other, a first member located to abut on the first surface, and a second member located to abut on the second surface. The first member and the second member form in combination, a sealing region which surrounds a certain section of the extending member with a gap being located in part. The first region and the second region are watertightly separated from each other by a sealant located in the gap at least in the sealing region. The first member includes a through hole which allows communication between the gap and the outside.

The waterproof case includes a case body, which defines an inner space for accommodating an electrically functional component. The waterproof case includes at least one opening, and at least one plug, which is mounted in the opening to form a part of a wall of the inner space. The plug includes at least one terminal conduit forming a feedthrough for a terminal. The plug is arranged in the opening to form with the case body an external space, and the external space is filled with an electrically insulating material for sealing the waterproof case.

A protective enclosure for an electrically-conductive element disposed along a component surface includes a base, a first side with an electrical connector, and a second side with an aperture for receiving a potting material. The base, the first side, and the second side at least partially define an internal void, and the internal void communicates with an external environment via the aperture.

An electronic circuit board includes electronic components to be mounted; a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern thereof. A plurality of contact relays as the electronic components is dispersedly arranged on the respective rigid board portions.

A method of encapsulating a printed circuit board of a motor controller with a potting material includes inserting the printed circuit board into a recess formed in a base portion of an encapsulation assembly such that a bottom surface of the printed circuit board is spaced from a surface of the recess. The method also includes coupling a cover portion of the encapsulation assembly to the base portion to define a cavity therebetween. The method further includes injecting the potting material into the cavity through at least one injection port defined in at least one of the base portion and the cover portion such that the printed circuit board is at least partially coated in the potting material.

An electronic circuit board includes a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects a mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern of the flexible board portion. The insulator of the flexible board portion is provided with a through-hole at a place where the circuit pattern of the flexible board portion is not stacked.

An apparatus for discriminating between liquids having differing thermal conductivities includes a thermally conductive substrate, a resistor and a thermistor mounted to the thermally conductive substrate. Two leads on the resistor enable a current to be passed through the resistor to generate heat, and two leads on the thermistor enable a current to be passed through the thermistor to generate a datum indicative of thermistor temperature. An electrical insulator encapsulates the resistor, the thermistor and part of the thermally conductive substrate. A remainder of the thermally conductive substrate may extend beyond the electrical insulator to provide a thermal path from the resistor and thermistor to a liquid in which the apparatus may be immersed.

An inverter system control (ISC) module is provided. The ISC module includes a power module defining a coolant channel for receiving a coolant, and a capacitor assembly disposed adjacent to the power module. The capacitor assembly includes a housing, a potting material disposed within the housing, and a plurality of power sources disposed within the potting material. The capacitor assembly further includes a cooling bar extending within the potting material between the power sources, and further extending out of the potting material and into the power module.

A power conversion device that supplies power to a load using a module incorporating a semiconductor element is such that a sealing wall that holds a sealing resin is provided on a metal case that cools the module, a feedback current channel, which is one wiring member forming a current channel that passes into and out of the semiconductor element, is the metal case, and another wiring member is disposed in proximity to and parallel with the sealing wall of the metal case.

A method of encapsulating an electronic assembly comprises disposing a plurality of electrically non-conductive particles on a substrate which carries one or more components of the electronic assembly; introducing a reactive parylene monomer in a vapor form into interstitial spaces among the plurality of the electrically non-conductive particles; and forming a parylene binder in the interstitial spaces of the electrically non-conductive particles from the reactive parylene monomer.