A potting boat adapted to receive a printed circuit board is described. The boning boat includes a base plate and a plurality of sidewalls projecting from the base plate, a plurality of cooling fins, a recessed portion, and an arm. The plurality of cooling fins are formed on one of the sidewalls. The cooling fins extend laterally outward from the one of the sidewalls. The recessed portion is in a first sidewall of the plurality of sidewalls, and extends laterally inward. The arm has a first end fixed to the sidewall and an opposite, second end not connected with the first sidewall. The arm at least partially overlays the recessed portion to define a void within which electrical wires connected to the printed circuit board are retained proximate the first sidewall.

A driver is provided. A driver (1) includes an aluminum substrate (10) to which electronic components (13) are joined, and a resin member (20) that covers the electronic components (13). The resin member (20) has a first resin portion (21) that covers the electronic components (13) and a second resin portion (22) that covers the first resin portion (21). The hardness of the first resin portion (21) is lower than the hardness of the second resin portion (22).

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. A protective cover layer includes a corrosion protection material and divides the interior space into an inner sub-space located between the base plate and the protective cover layer and an outer sub-space located between the protective cover layer and the housing. The at least one semiconductor switch is located in the inner sub-space such that an atmosphere in the outer sub-space passes through the protective cover layer of corrosion protection material before entering the inner sub-space. Additional anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

A housing includes a base and a mark piece. The base includes a bottom wall and at least one side wall. The at least one side wall is vertically connected to the bottom wall. A height of the side wall exists between a top end of the at least one side wall and the bottom wall. The mark piece is disposed on the bottom wall and extends from the bottom wall in a direction away from the bottom wall. The mark piece has a low scale and a high scale. A distance from the low scale to the bottom wall is less than the height of the side wall. A distance from the high scale to the bottom wall is substantially the same as the height of the side wall.

A connector device that includes a circuit board; a connector attached to the circuit board; a plurality of collars for external attachment; a first molded resin that is made of a first resin material whose melting point or softening point is 230° C. or less, and covers the entire circuit board and part of the connector; and a second molded resin that is welded to the first molded resin, is made of a second resin material whose melting point or softening point is higher than that of the first resin material for the first molded resin, and covers outer circumferences of the collars.

A housing includes a base and a mark piece. The base includes a bottom wall and at least one side wall. The at least one side wall is vertically connected to the bottom wall. A height of the side wall exists between a top end of the at least one side wall and the bottom wall. The mark piece is disposed on the bottom wall and extends from the bottom wall in a direction away from the bottom wall. The mark piece has a low scale and a high scale. A distance from the low scale to the bottom wall is less than the height of the side wall. A distance from the high scale to the bottom wall is substantially the same as the height of the side wall.

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

The present disclosure relates to a cover-securing mechanism for a transmitter housing closed by a screwed-on cover. The cover-securing mechanism includes a securement pin with a screw arranged at a first end region of the securement pin. A passageway, which is embodied to accommodate the securement pin, is integrated in the cover. A groove includes a circularly shaped section and is introduced into a cover facing region of the transmitter housing. The securement pin is securable at a transmitter housing far end of the cover in the passageway such that in a secured state a second end region of the securement pin protrudes inwardly into the groove and, as such, a twisting of the cover screwed onto the transmitter housing is constrained relative to the transmitter housing.

The invention concerns a door handle (10) for a vehicle (1), in particular an external door handle (10) for a movable part (2) of the vehicle (1), comprising: a cavity (11) which is at least partially formed by a housing (12) of the door handle (10), and an electronic unit (20), which is received in the cavity (11),
wherein the electronic unit (20) comprises a carrier unit (21), in particular an electric circuit board, such as a printed circuit board or a printed circuit, an electric connector unit (30) which comprises at least one electrically conductive connector element (31), in particular comprising at least one contact pin,
wherein the at least one connector element (31) is fixed, in particular soldered, welded or glued, to the carrier unit (21) in a material-locking manner.