A terminal block for transitioning electrical connections between two adjacent areas comprises at least one hole for receiving a stud. Each hole comprises a through hole and a sealing chamber surrounding the through hole. A stud is used for each hole. Each stud comprises a seal support flange and a sealing device. Each side of the seal support flange comprises a system for making an electrical connection. The seal support flange is sized to fit within the sealing chamber. The sealing device is located between the support flange and the sealing chamber. The stud is secured to the hole on the opposite side of the dielectric insert from the support flange and the sealing chamber to compress the sealing device between the support flange and the sealing chamber and cause the sealing device to fill the space of the sealing chamber and form a seal between the stud and the sealing chamber.

A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

The purpose of the present invention is to provide a control unit whereby the quantity of a seal material to be used can be reduced, while ensuring waterproof performance. This electronic control device is provided with: a housing, wherein a plurality of members are bonded, and a peripheral end portion thereof is configured from a plurality of sides; a circuit board housed in the housing; and seal structures that are disposed along the sides at the peripheral end portion. A seal material is provided to the seal structures such that the members are connected to each other. The seal structures disposed on one side of the peripheral end portion are configured such that each of seal cross sectional areas at end portions of the side is smaller than a seal cross sectional area at a center portion of the side.

A voltage regulator module includes a circuit board assembly, a magnetic core assembly and a molding compound layer. The circuit board assembly includes a printed circuit board and at least one switch element. The switch element is disposed on a first surface of the printed circuit board. Moreover, at least one first copper post, at least one second copper post, at least one third copper post and the magnetic core assembly are disposed on a second surface of the printed circuit board. The magnetic core assembly includes at least one opening. The at least one first copper post is penetrated through the corresponding opening, so that at least one inductor is defined by the at least one first copper post and the magnetic core assembly collaboratively. The molding compound layer encapsulates the printed circuit board and the magnetic core assembly in a double-sided molding manner.

An electronic component unit integrates a plurality of electronic components. The electronic component unit includes, a plurality of electronic components, a case that accommodates the plurality of electronic components, a mold material with which an inside of the case is filled and that seals the plurality of electronic components, and at least one bus bar connected to each of the electronic components. The case includes a case body that supports the plurality of electronic components, and at least one wall body formed separately from the case body and attached to the case body, and the bus bar penetrates through a gap between the case body and the wall body.

A method of potting e.g. a stack of printed circuit boards, the method comprising applying a first potting material to selected regions of the circuit to be potted and then applying a second, different, potting material over the circuit to be potted.

A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.

A connector device that includes a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector contains a resin material and fibrous inorganic fillers, a groove is formed in a region of a surface of the housing that is covered with the molded resin, the groove being formed by removing the resin material with the inorganic fillers remaining, and extending in a direction that intersects a mounting direction in which a counterpart connector is to be mounted to the connector, the groove has a depth and a width in a range from 50 μm to 150 μm inclusive, and the groove is filled with the molded resin.

A high-frequency module includes an antenna terminal, a transmission signal terminal, a reception signal terminal, a plurality of earth terminals, a switch, a transmission filter, a reception filter, and a multilayer board. The multilayer board includes a ground electrode arranged between the transmission filter and the reception filter. The plurality of earth terminals include a first earth terminal and a second earth terminal. When the high-frequency module is viewed in a direction perpendicular to a principal surface of the multilayer board, the reception signal terminal is provided between the antenna terminal and the transmission signal terminal, the first earth terminal is provided between the antenna terminal and the reception signal terminal, and the second earth terminal is provided between the reception signal terminal and the transmission signal terminal.

A patch-type sensor module is provided. A patch-type sensor module according to one embodiment of the present invention comprises: a power supply unit electrically connected with a flexible circuit board; a sensing unit which is mounted on the flexible circuit board and includes a temperature sensor for measuring a user's body temperature; a communication unit which allows power to be supplied using a wake-up function, wherein a pairing with an external communication module is concurrently established when power is supplied, and information measured through the sensing unit is then transmitted to the external communication module; a control unit for controlling operations of the power supply unit, the sensing unit, and the communication unit; and a protection member for preventing the flexible circuit board, the power supply unit, the sensing unit, the communication unit, and the control unit from being exposed to the outside.