A mounting arrangement for holding an electronic component includes a housing having a housing base and a housing cover configured to be mounted onto the housing base, a receptacle for accommodating an electronic component, such as a PCB, between the housing base and the mounted housing cover, and at least one component fixation member which is elastically deformable and configured to be located in the receptacle for fixating the electronic component in the receptacle. The mounting arrangement is easy to assemble, inexpensive and capable of securely holding an electronic component.

A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.

The invention relates to a control device having a casing, control electronics located in the casing, and at least one electrical feedthrough. By means of the electrical feedthrough, a current is provided for a load which is located outside the casing of the control device. The electrical feedthrough is located on the casing. The casing is fluid-tight at least in part, and the electrical feedthrough is located in a fluid-tight region of the casing. The electrical feedthrough has a metal core and an insulator surrounding the metal core. The metal core has an end face. A first bond is provided between the end face of the metal core and the control electronics, the first bond being laser-bonded at the end face.

An electric device includes an electric component and a housing having a lower housing part and an upper housing part. The electric component is supported on the lower housing part. The lower housing part and the upper housing part surround a housing volume in which the electric component is sealingly encased. A weld is formed between the upper housing part and the lower housing part. One of the lower housing part and the upper housing part has a protrusion welded to the other one of the lower housing part and the upper housing part. A gap is disposed between the lower housing part and the upper housing part, the gap extending radially from the protrusion to an outside of the housing. A solidified molten material from the weld is at least partially received in the gap.

A sealed electronic module (1) including at least one actionable part (2), the module (1) including a case (2) having: a watertight compartment (4) containing a printed circuit board (5), the compartment (4) being formed by a housing (13) with a unique opening (20), the housing (13) including the printed circuit board (5), and a sealing element (6a, 6b) configured for closing tightly the unique opening (20) by being fixed to the housing (13) and the printed circuit board (5).

A base substrate of an enclosure has a functional region and a cover substrate covers the functional region. The base substrate and cover substrate are directly connected together in a hermetically tight manner via at least one laser bonding line so the functional region is hermetically enclosed in the enclosure. For the connection between the substrates a minimum shear force is specified that the laser weld connection is to withstand, a minimum length is determined, by an empirically determined force per laser bonding line length P, for the total length of all bonding lines, and a contact surface width B is selected such that a ratio A.sub.i/A.sub.w, formed from a contact surface A.sub.i, at which the base substrate and the cover substrate can touch one another, and a laser bonding surface A.sub.w covered by the laser bonding lines with a width w, is in the range from 1 to 10.

The electronic device comprises a housing assembly extending along a longitudinal axis and comprising a first housing part and a second housing part configured to be joined to each other through an overlap welding, and an electronics carrier received within an inner space of the housing assembly defined when the first and second housing parts are joined to each other.

A sensor device includes a housing, a circuit substrate, a sensing element, and a sleeve. The sensor device further includes an inner cavity and a channel located on different sides of the circuit substrate, respectively. The sleeve has a cylinder wall located on a periphery of the channel. A tail end of the cylinder wall in an axial direction of the channel is sealably connected to the circuit substrate. The housing is provided with a matching part including an accommodation part and a first peripheral wall part forming the accommodation part. The sleeve is at least partially accommodated in the accommodation part. The first peripheral wall part is sealably connected to the cylinder wall. The inner cavity is not communicated with the channel. The sealing performance between the inner cavity of the sensor device and the channel is good. Also provided is a valve assembly having the sensor device.