Patent classifications
H05K5/066
AIR BAG CONTROL UNIT
The present invention relates to an airbag control unit capable of improving waterproof performance while forming a slim airbag control unit by improving a coupling structure between parts of an airbag control unit. The present invention discloses an airbag control unit including a housing that is in an enclosure shape and has an opening formed at an end thereof; a PCB that is coupled to the housing by coupling to a corner portion in the opening and an electrical connection structure in which a terminal pin is inserted into a terminal pin hole so that it is energized; and a cover that is provided in a shape covering the opening and includes an edge joined and fixed along an edge of the opening.
Method for forming a laser-welded connection and composite component
The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).
Electric Device Comprising A Sealed Housing Having a Lower Housing Part and an Upper Housing Part
An electric device includes an electric component and a housing having a lower housing part and an upper housing part. The electric component is supported on the lower housing part. The lower housing part and the upper housing part surround a housing volume in which the electric component is sealingly encased. A weld is formed between the upper housing part and the lower housing part. One of the lower housing part and the upper housing part has a protrusion welded to the other one of the lower housing part and the upper housing part. A gap is disposed between the lower housing part and the upper housing part, the gap extending radially from the protrusion to an outside of the housing. A solidified molten material from the weld is at least partially received in the gap.
ENCLOSURES FOR ELECTRONICS OF SURGICAL INSTRUMENTS AND METHODS OF MANUFACTURING THE SAME
An surgical enclosure includes electronics including at least one visual indicator and at least a first casing component enclosing the electronics therein. The first casing component is formed from a substantially transparent material and includes a first portion and a second portion. The first portion is treated to define a first finish that reduces transparency of the first portion. The second portion defines a greater transparency relative to the first portion to enable visualization of the at least one visual indicator therethrough.
Explosion-Proof Housing and Method for Producing the Same
An explosion-proof housing includes at least one metal housing part having at least one of a housing opening or receiving surface, and a support edge bordering said at least one of a housing opening or receiving surface. A cover part covers said at least one of a housing opening or the receiving surface. The cover part includes a peripheral cover edge which is connected to the support edge in an explosion-proof manner such that in the event of an explosion inside the housing, the explosion is prevented from crossing over to an explosive atmosphere surrounding the housing. A plurality of connection points are formed between the support edge and the cover edge. The connection points include interlocking depressions and protrusions. The protrusions are formed by partial melting of the cover edge. The depressions and the protrusions interlock with play in a longitudinal direction of the housing.
Method for manufacturing hermetic sealing lid member
The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.
Sealed package and method of forming same
Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.
Heat spreader device
A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.
SENSOR DEVICE AND VALVE ASSEMBLY WITH IMPROVED SEALING FEATURES
A sensor device includes a housing, a circuit substrate, a sensing element, and a sleeve. The sensor device further includes an inner cavity and a channel located on different sides of the circuit substrate, respectively. The sleeve has a cylinder wall located on a periphery of the channel. A tail end of the cylinder wall in an axial direction of the channel is sealably connected to the circuit substrate. The housing is provided with a matching part including an accommodation part and a first peripheral wall part forming the accommodation part. The sleeve is at least partially accommodated in the accommodation part. The first peripheral wall part is sealably connected to the cylinder wall. The inner cavity is not communicated with the channel. The sealing performance between the inner cavity of the sensor device and the channel is good. Also provided is a valve assembly having the sensor device.
Sealed package and method of forming same
Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.