A waterproof housing including a first case, a second case, a welded member, and a waterproof unit is provided. The first case includes a side wall and a groove. The side wall is disposed on an outer periphery of the first case. The groove is disposed on the side wall. The second case is disposed in correspondence with the first case, and the second case includes a first inner wall disposed at an inner side of the second case. The first inner wall and the side wall are disposed in correspondence with each other. The welded member is disposed in correspondence with the first case and the second case, and a joint direction of the welded member is different from an opening direction of the groove. The waterproof unit is disposed in the groove and is partially protruded from the side wall. The first case and the second case are jointed to each other via the welded member. The waterproof unit and the first inner wall are abutted against each other for sealing the first case and the second case.

Described are enclosures that include a friction stir weld, including electronic device enclosures, and precursors thereof, that contain a base and a cover that in an assembled condition form a joint at which a friction stir weld can be produced, as well as methods for producing a friction stir weld at a joint of such an assembly.

Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

The invention relates to an explosion-proof housing and to a method for connecting a housing part and a cover part, wherein the housing is formed at least from a metal housing part with at least one housing opening and/or receiving surface and a support edge which borders said housing opening and/or receiving surface and with a cover part which covers the housing opening or receiving surface and comprises a peripheral cover edge. The cover part and the housing part are connected together in an explosion-proof manner. In order to improve such a housing such that a corresponding connection of the housing part and cover part can be produced in a simple and secure manner without the use of adhesive in order to form an explosion-proof housing and such that the housing part and the cover part have a high degree of connection stability, a plurality of connection points between the support edge and the cover edge is formed as interlocking depressions and protrusions, the protrusions being formed by partial melting the cover edge.

The present disclosure relates to a waterproofing method for an electronic device. In one example method, silane is coated on an inner wall of a first housing of the electronic device and an inner wall of a second housing of the electronic device. The first and second housings and a main board of the electronic device are assembled. Fluoride is injected into a cavity of the electronic device through a liquid inlet hole on the first housing. An integral continuous waterproofing membrane is formed on the inner walls of the first and second housings through chemical reaction between the silane and the fluoride.

A sealed electronic module (1) including at least one actionable part (2), the module (1) including a case (2) having: a watertight compartment (4) containing a printed circuit board (5), the compartment (4) being formed by a housing (13) with a unique opening (20), the housing (13) including the printed circuit board (5), and a sealing element (6a, 6b) configured for closing tightly the unique opening (20) by being fixed to the housing (13) and the printed circuit board (5).

Methods of forming hermetically-sealed packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

The invention relates to a control device having a casing, control electronics located in the casing, and at least one electrical feedthrough. By means of the electrical feedthrough, current can be provided for a load which is located outside the casing of the control device. The electrical feedthrough is located on the casing. The casing is fluid-tight at least in part, and the electrical feedthrough is located in a fluid-tight region of the casing. The electrical feedthrough has a metal core and an insulator surrounding the metal core. The metal core has an end face. A first bond is provided between the end face of the metal core and the control electronics, the first bond being laser-bonded at the end face.

An enclosure for an electronic device includes a housing having a wall that defines a cavity that is configured to receive an electronic assembly therein. The wall includes tongue formed at a distal end. A cover includes a top wall and a side surface extending from the top wall to form a chamber. The housing is at least partially received within the chamber and the tongue of the housing is welded to a groove positioned within the chamber. Flash from the weld is contained within the enclosure so that no weld flash is visible on the exterior surface of the enclosure.

An enclosure for an electronic device includes a housing having wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a plurality of housing steps formed in an interior surface. A cap includes a side surface extending around a perimeter of the cap with a plurality of cap steps formed in the side surface. The cap is positioned at an entrance to the cavity such that the plurality of housing steps align with the plurality of cap steps and welded in place. Flash from the weld is captured in a flash trap so that no weld flash is visible on the exterior surface of the enclosure.