A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

A solid state circuit breaker assembly includes a transistor, a transient voltage suppression device, and a circuit board. The transistor and/or the transient voltage suppression device may be electrically connected to the circuit board. The solid state circuit breaker module may be configured to be connected to one or more non-scalable modules to regulate current. The solid state circuit breaker module may be configured to receive one or more scalable modules. The transistor and/or the transient voltage suppression device may be disposed on the circuit board in a substantially symmetrical configuration.

An adapter for installing electrotechnical components includes: a standardized support rail having a top-hat rail, and which has fastening means on an upper face thereof for installing an electrotechnical component, and fastening means on a bottom face thereof for installing on a front panel of an electrotechnical component. The fastening means on the bottom face have at least one latch hook for latching into a corresponding latch opening on the front panel of the electrotechnical component, and/or the fastening means on the bottom face have at least one snap hook for snapping into a corresponding snap opening on the front panel of the electrotechnical component.

A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

A semiconductor device includes a first wiring board having a first surface mounted with a primary radiator, and a second surface mounted with a semiconductor chip, a second wiring board mounted with a secondary radiator that forms an antenna with the primary radiator, and a third wiring board, arranged between the first and second wiring boards, and forming a predetermined gap with each of the first and second wiring boards. A first board-to-board connection member is arranged between the first and third wiring boards, to form a space between the first and third wiring boards, and regulate the spacing between the first and third wiring boards. A second board-to-board connection member is arranged between the second and third wiring boards, to form a space between the second and third wiring boards, and regulate a spacing between the second and third wiring boards.

Various embodiments of a modular electromechanical device are described herein. The modular electromechanical device includes a chassis and a plurality of functional modules that can be connected to the chassis. Each module is associated with a different functionality. The functionality of the modular electromechanical device is defined based on various attributes including the functionality of the different functional modules that are connected to the electromechanical device, the sequence in which the different functional modules are connected to the electromechanical device, the specific attachment structures used to attach the functional modules to the electromechanical device, or a pattern of traces formed within the chassis.

An electrical power delivery system includes a module stack, a conductive bus bar, and one or more energy storage devices. The module stack includes multiple modules stacked side by side along a stack axis. Each of the modules has a respective housing and internal electrical components within the housing. The conductive bus bar is oriented along a plane parallel to the stack axis. The bus bar is mounted along a side of the module stack and electrically connected to one or more of the modules. The one or more energy storage devices are electrically connected to the bus bar and extend from a side of the bus bar facing away from the module stack such that the bus bar is disposed between the one or more energy storage devices and the module stack.

An electronic device according to various embodiments comprises: a case for accommodating at least one electronic part; an upper cover for covering at least one part of an upper end of the case; and a connector, which is arranged on the upper cover, for electrically connecting an external module and the at least one electronic part, wherein the upper cover can guide heat generated from the at least one electronic part such that the heat is discharged to the outside along a side part of the upper cover. Additional other embodiments are possible.

An electronic device includes a first module, a second module located in a post-stage of the first module, and a third module located in a post-stage of the second module. The first module includes a determination unit that determines whether or not a predetermined condition is satisfied in a first state where a communication unit of the first module and a communication unit of the second module are electrically connected to each other and the communication unit of the second module and a communication unit of the third module are electrically separated from each other by a first switch, and a notification unit that performs a predetermined notification based on a determination result as to whether the predetermined condition is satisfied.

Communication device board and a communication device are provided. A connector of the communication device board includes a fixed position and a contact position. The fixed position and the contact position; have different levels. The fixed position is fixedly connected one end of an inner side of a conductive resilient sheet. An outer side of the conductive sheet is provided with an insulating coating. When the fixed position fixedly connected to the end of the inner side of the conductive resilient sheet, and a mating gap between the connector of the communication device board and a corresponding communication device connector is smaller than a preset threshold range, A second end of the inner side of the conductive resilient sheet is in contact with the contact position (12).