A modular output device comprises a mainboard, a first assembling component, and a second assembling component. The first assembling component is configured in a first assembly structure of the mainboard, and a first connection module of the first assembling component is electrically connected to a first electrical connector, which allows a master function module and a first function module to transmit data to each other. The second assembling component is configured in a second assembly structure, and a second connection module is electrically connected to a second electrical connector, which allows the master function module and a second function module to transmit data to each other. In this way, the first function module and the second function module can transmit data to an associated computer through the main function module.

A method for manufacturing an automotive mirror, in particular a side mirror, includes forming a printed circuit board as flexible printed circuit board with n+1 branches, nεN, providing n modules each including at least one electronic element housed within a plastic casting and connected to conducting paths on at least one of the surfaces of the plastic casting, and at least one standard gripping point, guiding structure, snap connection element and/or sealing member provided by the plastic casting, connecting up to n of said branches to one module each and connecting one branch to cables or a cable harness to be connected to a power supply and/or a control unit outside the mirror, providing mirror parts free of electronic elements, and assembling the mirror parts and the modules.

Disclosed is a circuit unit with a novel structure that can counter the heat generation by resistors while suppressing an increase in size and cost of the circuit unit. A circuit unit includes a wiring member, a lower case that holds the wiring member, an upper case that covers the lower case, and resistors connected to the wiring member, wherein the upper case include wall portions that surround peripheries of the resistors, and wherein, in a first orthogonal direction orthogonal to the longitudinal direction of the resistors, the separation distance between intermediate portions in the longitudinal direction of the resistors and the wall portions of the upper case is greater than the separation distance between end portions in the longitudinal direction of the resistors and the wall portions of the upper case.

The invention concerns a functional component (400) for a component construction system (100) for electrical connection to a bridge module (300) which comprises a housing (421) with a component-securing arrangement (401) for securing the functional component (400) to a support profile rail (200).

An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).

A resin structure includes: a box-shape main body having multiple regions; and multiple lids assembled to the main body. The main body has a first partition wall extending to separate between a pair of the regions. A first one of the multiple lids covers one of the pair of the regions and has a second partition wall provided at its edge portion. A second one of the multiple lids covers the other of the pair of the regions and has a third partition wall provided at its edge portion. The first partition wall and the second partition wall are located to overlap each other in a thickness direction of the first partition wall to form a multi-layer wall structure, and the first partition wall and the third partition wall are located to overlap each other in the thickness direction to form a multi-layer wall structure.

Techniques are disclosed for systems and methods associated with a modular electrical power distribution system with module detection. A modular electrical power distribution system may include a plurality of controllers, a shared serial communication bus between the plurality of controllers, and a module detection signal line coupled through the plurality of controllers. The plurality of controllers may include a master controller, a power input controller, and one or more load controllers disposed between the master controller and the power input controller.

A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.

A three-dimensional interconnect structure having a top surface, a first coaxial conductor, and a shielded chamber is disclosed. The first coaxial conductor is filled with a solid dielectric medium. The first coaxial conductor has a segment that runs parallel to the top surface and a segment connects the first coaxial conductor to the top surface. Conductive pads on the top surface are adapted to receive a signal and couple that signal to the first coaxial conductor at the top surface. The shielded chamber contains a device connecting two conductors that are part of the three-dimensional interconnect structure to one another in that chamber. The shielded chamber is filled with the solid dielectric medium. The structure is a solid block composed of a mixture of metal structures interspersed with the solid dielectric medium.

An electrical junction box has a main body provided with a circuit board, and a cover externally fitted to the main body. The electrical junction box is assembled in a state in which the main body is accommodated in the cover. The main body includes an opposing surface that opposes an inner surface of the cover. The opposing surface has a water capturing hole that is a recess that opens toward the inner surface of the cover. A first opposing distance between the inner surface of the cover and an upper opening edge of the water capturing hole is larger than a second opposing distance between the inner surface of the cover and a lower opening edge of the water capturing hole.