Patent classifications
H05K7/06
POWER SUPPLY STRUCTURE
A load board includes an electronic component and first wiring connected thereto. A power supply board includes a DC/DC converter and second wiring connected thereto. A bus block includes prismatic block-shaped conductors arranged with a gap interposed therebetween and fixed. The bus block is held between the first plate member and the second plate member such that the end faces of the block-shaped conductors are in contact with the load board and the power supply board. The bus block is connected to the first wiring and the second wiring such that current flows in a direction from the power supply board to the load board in one of two adjacent block-shaped conductors and that current flows in a direction from the load board to the power supply board in the other block-shaped conductor.
POWER SUPPLY STRUCTURE
A load board includes an electronic component and first wiring connected thereto. A power supply board includes a DC/DC converter and second wiring connected thereto. A bus block includes prismatic block-shaped conductors arranged with a gap interposed therebetween and fixed. The bus block is held between the first plate member and the second plate member such that the end faces of the block-shaped conductors are in contact with the load board and the power supply board. The bus block is connected to the first wiring and the second wiring such that current flows in a direction from the power supply board to the load board in one of two adjacent block-shaped conductors and that current flows in a direction from the load board to the power supply board in the other block-shaped conductor.
Methods of manufacture of communication connectors and communication connector circuits
Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.
Mobile vibration isolation device
Mobile vibration isolation devices and methods for reducing vibration transfer to electrical or electronic devices are provided. One such mobile vibration isolation device includes an array of two or more vibration isolation elements, and one or more flexible elements. The array of vibration isolation elements is connected by said one or more flexible elements. Preferably, the vibration isolation elements have at least a portion thereof of a cross linked polymer foam. More preferably, the vibration isolation elements have at least a portion thereof of SORBOTHANE®. A method for reducing vibration transfer to electrical or electronic devices includes the steps of providing a mobile vibration isolation device, and interposing the mobile vibration isolation device between the electrical or electronic device and a vibrating surface, thereby reducing vibration transfer to the electrical or electronic device.
Mobile vibration isolation device
Mobile vibration isolation devices and methods for reducing vibration transfer to electrical or electronic devices are provided. One such mobile vibration isolation device includes an array of two or more vibration isolation elements, and one or more flexible elements. The array of vibration isolation elements is connected by said one or more flexible elements. Preferably, the vibration isolation elements have at least a portion thereof of a cross linked polymer foam. More preferably, the vibration isolation elements have at least a portion thereof of SORBOTHANE®. A method for reducing vibration transfer to electrical or electronic devices includes the steps of providing a mobile vibration isolation device, and interposing the mobile vibration isolation device between the electrical or electronic device and a vibrating surface, thereby reducing vibration transfer to the electrical or electronic device.
PRINTED CIRCUIT BOARD (PCB), PCB ASSEMBLY, AND WASHING MACHINE INCLUDING THE SAME
A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. the plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.
PRINTED CIRCUIT BOARD (PCB), PCB ASSEMBLY, AND WASHING MACHINE INCLUDING THE SAME
A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. the plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.
Housing arrangement of a power electronics device
A housing arrangement of a power electronics device includes one power module or several identical power modules, each module with at least one part connected to a hazardous voltage, the arrangement further including a housing part having room for at least one power module. Each power module includes an enclosure part which essentially surrounds the power module and includes electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part. The power modules and the enclosure part of the power modules are arranged such that when the power module is installed to the housing part the power module is electrically insulated from the housing part and external connections of the power module are directed to the front side of the housing part.
Housing arrangement of a power electronics device
A housing arrangement of a power electronics device includes one power module or several identical power modules, each module with at least one part connected to a hazardous voltage, the arrangement further including a housing part having room for at least one power module. Each power module includes an enclosure part which essentially surrounds the power module and includes electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part. The power modules and the enclosure part of the power modules are arranged such that when the power module is installed to the housing part the power module is electrically insulated from the housing part and external connections of the power module are directed to the front side of the housing part.
Power supply control apparatus and manufacturing method of power supply control apparatus
A power supply control apparatus includes: a control board that is configured to control a voltage of a battery module; and a bus bar module that is configured to electrically connect the control board to the battery module, the control board and the bus bar module are arranged in a stacked manner, and the bus bar module includes a plurality of bus bars that are made to be independent by cutting off junctions connecting the bus bars to each other and a resin member that supports the bas bars in a state where the junctions are exposed.