An electrical junction box including: bus bars; a circuit board of which one side opposes the bus bars; a conductive portion that is provided on the one side of the circuit board, and is exposed from the other side of the circuit board; an opening that is provided in parallel with the conductive portion in the circuit board, and from which a portion of the bus bars is exposed; a switching element that is arranged on the other side of the circuit board, and of which an input terminal or an output terminal is connected to the conductive portion; and a conductive piece that is arranged straddling a portion of the bus bars and the conductive portion.

An electrical junction box including: bus bars; a circuit board of which one side opposes the bus bars; a conductive portion that is provided on the one side of the circuit board, and is exposed from the other side of the circuit board; an opening that is provided in parallel with the conductive portion in the circuit board, and from which a portion of the bus bars is exposed; a switching element that is arranged on the other side of the circuit board, and of which an input terminal or an output terminal is connected to the conductive portion; and a conductive piece that is arranged straddling a portion of the bus bars and the conductive portion.

An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

An electric deviceincludes a case, a circuit substratethat is disposed in the case, and electronic componentsthat are disposed in the case, and generate heat when energized. The caseis filled with a liquid insulating-and-cooling medium, the circuit substrateis disposed in an orientation in which the normal lines of the substrate surfaces that are the plate surfaces of the circuit substrateare horizontal, the electronic components are disposed on the lower side of the case, and at least some of the electronic componentsare immersed in the liquid insulating-and-cooling medium.

A circuit structure includes: an upper case having positioning holes; bus bars that are provided in an inductor disposed in the upper case and that have through holes; terminals that are connected to electric wires and that have bolts disposed thereon that penetrate the through holes; nuts that sandwich the bus bars between the nuts and the terminals by being screwed onto the bolts; and a lower case that is attached to the upper case. The lower case includes: front walls, left walls, and right walls that project upward from the lower case and position the terminals relative to the lower case by coming into contact with the terminals; and case positioning portions that project upward from the lower case and that are inserted into the positioning holes.

A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.

A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.

A power converter includes a semiconductor module, a capacitor module, a control board, and an insulating plate. The capacitor module includes a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and a power supply outside the power converter, and a second connection terminal electrically connected to the semiconductor module. The insulating plate is located between the capacitor module and the control board so as to cover at least one of the first connection terminal and the second connection terminal.

A power converter includes a semiconductor module, a capacitor module, a control board, and an insulating plate. The capacitor module includes a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and a power supply outside the power converter, and a second connection terminal electrically connected to the semiconductor module. The insulating plate is located between the capacitor module and the control board so as to cover at least one of the first connection terminal and the second connection terminal.