Cable organizers including a body, a clamp, and a cleat. The body defines a channel complementarily configured with a cable. The clamp and the cleat are mounted to the body proximate the channel. The clamp and the cleat are configured to selectively secure the cable to the body in the channel, The cleat is configured to selectively secure the cable to the body in the channel. In some examples, the cable organizer includes an adhesive layer and/or a sled mechanism.

An electronic device is provided and includes a circuit board and a casing. The circuit board includes a plate body, a perforation and a ground wire. The perforation penetrates through the plate body, the ground wire is electrically coupled with the plate body and crosses over the perforation. The casing includes a bottom plate and a clamping structure. The clamping structure is disposed on the bottom plate and includes a first clamping part and a second clamping part. The circuit board is disposed in the casing, and the clamping structure penetrates through the plate body through the perforation, so that the circuit board is positioned on the casing, and the ground wire is clamped by the first clamping part and the second clamping part of the clamping structure. Consequently, the circuit board is grounded with the casing.

An electronic device is provided and includes a circuit board and a casing. The circuit board includes a plate body, a perforation and a ground wire. The perforation penetrates through the plate body, the ground wire is electrically coupled with the plate body and crosses over the perforation. The casing includes a bottom plate and a clamping structure. The clamping structure is disposed on the bottom plate and includes a first clamping part and a second clamping part. The circuit board is disposed in the casing, and the clamping structure penetrates through the plate body through the perforation, so that the circuit board is positioned on the casing, and the ground wire is clamped by the first clamping part and the second clamping part of the clamping structure. Consequently, the circuit board is grounded with the casing.

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

The power controller apparatus includes a plurality of parts including a heat member and a heat dissipation member. The power controller apparatus includes a housing for accommodating these plurality of parts. The power controller apparatus includes a snap fit and a thermal conductive member. The snap fit connects the heat member and the heat dissipation member. The thermal conductive member is arranged between the heat member and the heat dissipation member. The thermal conductive member includes a filler having anisotropy with respect to thermal conductivity. The filler is oriented so as to exhibit high thermal conductivity in a stacking direction between the heat member and the heat dissipation member.

The power controller apparatus includes a plurality of parts including a heat member and a heat dissipation member. The power controller apparatus includes a housing for accommodating these plurality of parts. The power controller apparatus includes a snap fit and a thermal conductive member. The snap fit connects the heat member and the heat dissipation member. The thermal conductive member is arranged between the heat member and the heat dissipation member. The thermal conductive member includes a filler having anisotropy with respect to thermal conductivity. The filler is oriented so as to exhibit high thermal conductivity in a stacking direction between the heat member and the heat dissipation member.

A self-aligning mechanical mount and electrical connection system for an electronic module comprises a mechanical mount assembly configured to be integrated into or attached to a base frame and defining a mount connection position assurance (CPA) feature for self-aligning and securing of the electronic module therein, and an electrical connection assembly configured to be integrated into or attached to the mechanical mount assembly and comprising a modular electrical connector (i) being electrically connected to an electrical backbone wire cable and (ii) defining a connector CPA feature for self-aligning the modular electrical connector with a corresponding electrical connector integrated into or attached to the electronic module when the electronic module is secured in the mechanical mount assembly.

A self-aligning mechanical mount and electrical connection system for an electronic module comprises a mechanical mount assembly configured to be integrated into or attached to a base frame and defining a mount connection position assurance (CPA) feature for self-aligning and securing of the electronic module therein, and an electrical connection assembly configured to be integrated into or attached to the mechanical mount assembly and comprising a modular electrical connector (i) being electrically connected to an electrical backbone wire cable and (ii) defining a connector CPA feature for self-aligning the modular electrical connector with a corresponding electrical connector integrated into or attached to the electronic module when the electronic module is secured in the mechanical mount assembly.

A component holding device for the fixed-position arrangement of an electric component on a circuit board, having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for the fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element, and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board.

A component holding device for the fixed-position arrangement of an electric component on a circuit board, having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for the fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element, and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board.