A first main body portion and a second main body portion of an electronic package are mounted on a mount portion of a support body, first metal projections are caused to enter first receiving recesses, and second metal projections are caused to enter second receiving recesses. When a clip member is mounted in the a first direction, the first metal projections are pressed by first pressing portions of the clip member, the second metal projections are pressed by second pressing portions of the clip member, and an elastic piece is pressed against a rear side of the support body. Thus, the electronic package is secured.

Apparatuses, systems, and methods for interfacing with multiple components connected to a printed circuit board. An apparatus includes a plurality of hardware components that each include a first interface. An apparatus includes a printed circuit board that includes a plurality of interfaces that communicatively couple each of the hardware components to the printed circuit board via the first interface. The printed circuit board includes a second interface that communicatively couples the printed circuit board to an information handling device and manages communications between the information handling device and each of the hardware components coupled to the printed circuit board.

A heat dissipating apparatus includes a heat sink, a first air moving device coupled to a first end of the heat sink, and a second air moving device coupled to a second end of the heat sink. The first air moving device drives an airflow to move through the heat sink in a direction and the second air moving device drives the airflow to move through the heat sink in the direction.

In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage. The inventive method for producing a printed circuit board with at least one recessed component, is characterized by the steps of providing at least one conductive layer, structuring said conductive layer to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, leaving at least one passage in the laser-stop device for passing-through the fan-out lines, and applying a cap layer to said conductive layer, the cap layer having an opening in registration with each passage.

A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

There is provided a rail attachment apparatus for an electrical device in which a biasing elastic function is imparted to a slider itself, whereby the slider can be adjusted to be thin and the number of components can be decreased. The rail attachment apparatus includes a nipping portion that nips one side edge of an attaching rail fixed to an attaching surface of the electrical device, and a slider that is opposed to the nipping portion and slidably held at the other side edge of the attaching rail in a direction intersecting with this attaching rail. The slider is provided with integrally formed bending elastic portions which bias the slider in a direction to enable nipping the attaching rail.

There is provided a rail attachment apparatus for an electrical device in which a biasing elastic function is imparted to a slider itself, whereby the slider can be adjusted to be thin and the number of components can be decreased. The rail attachment apparatus includes a nipping portion that nips one side edge of an attaching rail fixed to an attaching surface of the electrical device, and a slider that is opposed to the nipping portion and slidably held at the other side edge of the attaching rail in a direction intersecting with this attaching rail. The slider is provided with integrally formed bending elastic portions which bias the slider in a direction to enable nipping the attaching rail.

A hold down member can be surface mounted to a substrate, such that a post of the hold down member extends at least into an interposer. Accordingly, when an on board transceiver is placed in electrical communication with the interposer, a fastener can be inserted at least into the on board transceiver so as to attach to the post, thereby securing the on board transceiver to the interposer and the substrate.