Patent classifications
H05K7/1438
Connector interface for liquid-cooled IT servers
Embodiments are disclosed of a fluid connector including a connector body having at least a first exterior surface and a second exterior surface. A male interface projects longitudinally from the first exterior surface and includes a male internal chamber bounded in part by a pair of spaced-apart laterally-moving fluid gates coupled to each other by a first elastic member. A female interface longitudinally adjacent to the male interface is recessed into the first exterior surface. The female interface includes a female internal chamber bounded in part by a longitudinally-moving fluid gate, the longitudinally-moving fluid gate being biased into its closed position by a second elastic member. A plurality of fluid distribution ports are positioned on the second surface, each being fluidly coupled to the male interface, the female interface, or both.
BACKPLANE AND METHOD FOR PRODUCING SAME
A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.
BACKPLANE AND METHOD FOR PRODUCING SAME
A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.
Back cover module
A back cover module adapted to be disposed on a casing having a back opening is provided. The back cover module includes a fixing bracket, a sliding bracket and a rotating mask. The sliding bracket is slidably disposed on the fixing bracket along a first direction. The rotating mask is pivoted to the sliding bracket. When the fixing bracket is fixed to a position of the casing adjacent to the back opening, the fixing bracket and the sliding bracket are adapted to be inside the casing and a portion of the rotating mask is exposed from the casing. The rotating mask is adapted to follow the sliding bracket and move relative to the fixing bracket toward the first direction to a position out of the casing, and is adopted to rotate relative to the sliding bracket and shield the back opening after being moved out of the casing.
SSD MULTIPLER WITH VIBRATION RESISTANCE AND STRUCTURE FOR STACKING SSD MEMORY CARDS OF VARIOUS SIZES IN HORIZONTAL SLIDING MANNER
Provided is a high-capacity SSD that has the same form factor as 3.5-inch hard disk drives and has a structure where memory cards, such as standard M.2 SSDs, M.3 SSDs or nonstandard full-scale SSDs, are inserted in a horizontal sliding manner into an exterior having the same size as a 3.5-inch hard disk drive, and are provided in a multi-stage arrangement in the vertical direction. The SSD multiplier provides a high-capacity SSD case structure having a novel structure where a vertical backplane board is placed at a fixed position such that the case does not need to be disassembled even when an SSD memory card is replaced with another SSD memory card having a different length. Further provided is a case structure which can handle the various sizes of SSD memory cards that are used, where individual SSD memory cards have vibration resistance characteristics against external vibrations in XYZ-axis directions.
BACKLIGHT MODULE AND DISPLAY APPARATUS
The present disclosure provides a backlight module and a display apparatus. In one embodiment, the backlight module includes: a frame body defining a cavity therein and having an opening communicated with the cavity; and a light strip disposed at the opening of the frame body and detachably connected to the frame body, wherein the light strip comprises a lamp bead that is disposed toward the cavity through the opening.
Backplane interface sets
An example device in accordance with an aspect of the present disclosure includes at least one interface set, including a first interface, at least one second interface, and at least one third interface. A first portion of the first interface is coupled to a second portion of the at least one second interface. A second portion of the first interface is coupled to a first portion of the at least one third interface. The first portion of the first interface is isolated from the second portion of the first interface, the first portion of the second interface is isolated from the second portion of the second interface, and the first portion of the third interface is isolated from the second portion of the third interface.
FRAME AND ELECTRONIC FRAME
A frame includes a first frame, a back case and a second frame. The first frame includes a first frame plate and a first frame wall, the back case includes a back case plate and a back case wall, the second frame includes a second frame plate and a second frame wall, and the second frame surrounds the first frame and the back case. The second frame plate is located on a side of the first frame plate facing away from the back case plate, and the first frame wall is protruded from a surface of the first frame plate facing towards the back case plate, the back case wall is protruded from a surface of the back case plate facing towards the first frame plate, and the second frame wall is protruded from a surface of the second frame plate facing towards the first frame plate.
BACKPLATE AND PROTECTIVE COVER FOR ELECTRONIC PRODUCT
A backplate includes a backplate body, a movable portion and an ejection structure. The backplate body includes an elastic material and has an edge portion and a central portion. The movable portion is arranged at a peripheral edge of the backplate body. The ejection structure is arranged on the backplate body and has a first operating state. The ejection structure is configured to eject the edge portion of the backplate body and the movable portion in a direction away from the central portion of the backplate body when it is in the first operating state, so that the edge portion of the backplate body extends in the direction away from the central portion thereof.
METHOD FOR INSERTING, LOCKING AND EXTRACTING AN ELECTRONIC MODULE AND HOUSING STRUCTURE FOR IMPLEMENTING SAME
The invention relates to a structure (1) for housing electronic modules (2) provided with a system for inserting, locking and extracting such modules (2) including adjacent individual recesses separated by side rails and a motherboard (13), each recess being intended for receiving an electronic module (2). The system for inserting, locking and extracting includes one lever arm (3) per individual recess (10) provided at a distal end with a device for pivoting on the motherboard (13) and guiding device (31) capable of engaging with a circulation device (22, 22) connected to the electronic module (2) in order to couple connectors of the electronic module (2) with the connectors of the motherboard (13), as well as a device for automatic locking and unlocking of a proximal end (3p) of each lever arm (3).