Patent classifications
H05K7/1461
TECHNOLOGIES FOR DYNAMICALLY MANAGING RESOURCES IN DISAGGREGATED ACCELERATORS
Technologies for dynamically managing resources in disaggregated accelerators include an accelerator. The accelerator includes acceleration circuitry with multiple logic portions, each capable of executing a different workload. Additionally, the accelerator includes communication circuitry to receive a workload to be executed by a logic portion of the accelerator and a dynamic resource allocation logic unit to identify a resource utilization threshold associated with one or more shared resources of the accelerator to be used by a logic portion in the execution of the workload, limit, as a function of the resource utilization threshold, the utilization of the one or more shared resources by the logic portion as the logic portion executes the workload, and subsequently adjust the resource utilization threshold as the workload is executed. Other embodiments are also described and claimed.
Conductive thermal management architecture for electronic modules in a two-card assembly
A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.
Electronic device storage rack and rack-mounted type electronic device
An electronic device storage rack is equipped with a pair of first columns provided at intervals in a width direction; a pair of second columns provided at intervals in the width direction at positions away from the pair of first columns on a back side; a plurality of pairs of rails which connect the first column and the second column to support the electronic device main body to be slidable in a depth direction; a first fixing piece which is movable between an abutment position capable of abutting on the first column from the front side on the front side of the electronic device main body and a non-abutment position disposed between the first columns; and a second fixing piece which is movable between the abutment position capable of abutting on the second column from the back side on the back side of the electronic device main body and the non-abutment position disposed between the second columns.
Technologies for switching network traffic in a data center
Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
HARD DRIVE ENCLOSURE
A hard drive enclosure with functionality of quick-release, is for application in a host computer, and comprises: an accommodating unit, a plurality of removable units, a connection inter face module, and a connection module. Wherein the accommodating unit has an accommodating space and a receiving opening. And the plurality of removable units is inserted into the accommodating space through the receiving opening, and each of the plurality of removable units carries with a storage device. In the present invention, according to particular design of electrical connectors constituted by printed circuit board assembly, so as to improve insufficient space for electrical routing. In other words, the hard drive enclosure of the present invention includes advantages of decreasing assembly time and low production cost.
MODULAR HIGH DENSITY COMMUNICATIONS CHASSIS
A modular high density communications chassis, comprising a chassis and slidable carrier module is provided. The chassis comprises a second track having a first and second stage access fixing recess and a sectional sliding mechanism having a moveable squeeze-release latching rail mechanism. The slidable carrier module comprises a push-pull tab and a snap-fit mechanism, and is slidably mounted to the second track and squeeze-release latching rail mechanism. The slidable carrier module is slidably mounted to the chassis vertically. The snap-fit mechanism is configured to secure and release the slidable carrier module in and from a first stage position when corresponding to the first stage access fixing recess, and in and from a second stage position when corresponding to the second stage access fixing recess, via pulling and pushing of the at least a push-pull tab, respectively, providing staged access to the slidable carrier module and staged management of the connector cables extending to and therefrom.
CONDUCTIVE THERMAL MANAGEMENT ARCHITECTURE FOR ELECTRONIC MODULES IN A TWO-CARD ASSEMBLY
A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.
HEAT DISSIPATING STRUCTURE CAPABLE OF CONDUCTING HEAT FROM A DETACHABLE MODULE TO A CASE MODULE, AND ELECTRONIC DEVICE THEREWITH
A heat dissipating structure is for conducting heat generated by a detachable module to a case module. The heat dissipating structure includes a driving component disposed on a side of the detachable module, a driven component pivotally disposed on the case module and a heat dissipating component connected to the driven component. The driving component is slidable relative to the case module along with the detachable module. The heat dissipating component is for abutting against the detachable module and the case module. When the detachable module slides relative to the case module along an installing direction, the driving component drives the driven component to pivot relative to the case module in a first pivoting direction to drive the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component.
COOLING MECHANISM FOR ELECTRIONIC COMPONENT MOUNTED ON A PRINTED WIRING BOARD
An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.
Electronic device and frame module thereof
A frame module is provided, which is adapted to connect to an object unit. The frame module includes a module housing, a latch, and a cover. The object unit is connected to the module housing. The latch is connected to the module housing, which is adapted to be moved between the first latch position and the second latch position. When the latch is in the first latch position, the latch is connected to the object unit to restrict the object unit. When the latch is in the second latch position, the latch is separated from the object unit. The cover pivots on the module housing, which is adapted to be rotated between the first cover orientation and the second cover orientation. When the cover is in the first cover orientation, the cover presses the latch and keeps the latch in the first latch position.