A system and method for thermally coupling memory devices, such as DIMM memory modules, to an associated memory controller such that both are cooled together at the same relative temperature. By maintaining all of the devices at a much more uniform temperature, memory timing issues are effectively eliminated. In accordance with an exemplary embodiment, the controller chip is physically located between two or more banks of memory, and is positioned under an adjoining heat sink while the memory DIMMs are positioned laterally of the controller chip in angled DIMM slots and are coupled to the controller chip with respective heat spreaders.

A data center may be organized into modules, wherein the modules are purchased pre-configured to provide certain functionality of an information handling system. The modules may include utility modules, information technology (IT) modules, and air handling unit (AHU) modules. The utility module may provide infrastructure for other modules, such as electrical power service infrastructure. Electrical power may be provided by the utility module to other modules through two or more redundant busses connected to different electrical sources. The utility module may also include a control system that allows the utility services to be reconfigured to allow installation of new modules without interrupting service to existing modules.

A portable data center is configured to be supported by any suitable self-propelled motor vehicle, and transported to a client location, such that a large volume of data can be transmitted to, and stored on, computing devices of the portable data center via a hard wire communication link. The portable data center can then be transported to a data center building so as to store the data received at the client location on one or more computing devices housed in the data center building.

Modular, expandable rack assembly physically supports components of information handling systems. Base structure of interconnected panels form volumetric space having front section and rear section, with opposing side panels forming front access space and rear access space, respectively, having width that supports insertion of standard full-width IT gear. Guides are located within interior surfaces of opposing side panels at the front section to rear section. Block chassis has frame that provides block height to enable insertion of at least one layer of up to N side-by-side fully functional IT gears within block chassis, which in turn is physically inserted into front section of base structure and held in place by opposing guides of opposing side panels. When N is 3, three side-by-side one-third width IT sleds, each containing IT gear, are inserted in respective one-third width IT bays of block chassis.

Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.

A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.

An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.

Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

A system includes a top-of-rack, a first plurality of chassis, and a first backplane. The first plurality of chassis each includes at least one rack module and a chassis network switch that connects to each of the at least one rack module. The first backplane includes a first backplane network switch that connects to the top-of-rack and connects to each of the first plurality of chassis via the chassis network switch of each of the first plurality of chassis.

An apparatus may include a chassis that can receive a sled and a locking mechanism. The locking mechanism can mechanically lock the sled to the chassis to prevent a sudden power loss that can be caused from an unexpected removal of the sled from the chassis. To avoid a sudden power loss, a voltage-sensing electrical switch lock can be implemented to the chassis to mechanically lock the sled to the chassis until the sled is ready to be removed. The sled may include one or more computing devices that need to be inactive before removing the sled. The apparatus includes a controller that may detect whether at least one of computing devices in the sled are in an active state or in an inactive state. Based on the determination of the state of the computing devices in the sled, the controller may activate the locking mechanism or de-active locking mechanism.