One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

The electronic cabinet for enclosing electronic components generally has a housing having a base and a cover being connected to one another a plurality of lateral walls, one of the plurality of lateral walls having a first opening; a lateral perforated plate being mounted to the housing and extending over the first opening, the lateral perforated plate having a plurality of perforations; and a protector plate being mounted to the housing and extending over the lateral perforated plate to cover the plurality of perforations of the lateral perforated plate, the protector plate defining at least one air inlet between the protector plate and the lateral perforated plate.

An electronic device having a heat dissipation function is proposed. The electronic device includes: a heating element (20); a shield can (30) covering the heating element (20) to block electromagnetic waves; and a heat dissipation means (50) provided to be adjacent to the heating element (20) and causing an ionic wind to flow into a shielded space (32) of an inner part of the shield can (30). Here, the heat dissipation means (50) includes: a wire electrode (70) provided to be adjacent to an entrance of the shielded space (32) of the shield can (30) and becoming an emitter electrode; and a power module (80) connected to the wire electrode (70) and applying voltage to the wire electrode (70), wherein the shield can (30) is grounded at the same time of being connected to the power module (80) and becomes a collector electrode.

An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket.

A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

In an example, an air filter system includes an air filter and a thermally conductive particulate sensor (TCPS). The TCPS includes a temperature sensor to measure a first temperature of the TCPS at a first time, measure a second temperature of the TCPS at a second time, and provide the measured first temperature and the measured second temperature to a controller. The controller to determine an actual rate of temperature change based on the measured first temperature and the measured second temperature, compare the actual rate of temperature change to a target rate of temperature change, and provide a notification when a difference between the actual rate of temperature change and the target rate of temperature change is greater than an accumulation threshold indicative of a threshold amount of particulate accumulation on the TCPS.

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

The electronic cabinet for enclosing electronic components generally has a housing having a base and a cover being connected to one another a plurality of lateral walls, one of the plurality of lateral walls having a first opening; a lateral perforated plate being mounted to the housing and extending over the first opening, the lateral perforated plate having a plurality of perforations; and a protector plate being mounted to the housing and extending over the lateral perforated plate to cover the plurality of perforations of the lateral perforated plate, the protector plate defining at least one air inlet between the protector plate and the lateral perforated plate.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.