This description provides a system for recovering energy released by a computing unit. The system comprises a first computing unit that generates heat energy as the first computing processes information, an energy recovery unit configured to recover the heat energy generated by the first computing unit, and a second computing unit coupled to the energy the energy recovery unit. The energy recovery unit further comprise a pump configured to transport a working fluid to absorb the heat energy generated by the first computing device and a conversion device configured to convert the absorbed heat energy into electrical energy. The electrical energy is passed to the second computing unit to supply power for the second computing unit to process information.

A stationary induction charging device for wireless energy transfer may include a housing base, a housing cover, a transmitting coil, at least one magnetic field conductor, and a power electronics unit. The housing base and the housing cover may define an installation space and a venting space. The transmitting coil, the magnetic field conductor, and the power electronics unit may be arranged in the installation space. The housing base may include a plurality of coolant channels through which a liquid is flowable such that the housing base forms a heat exchanger. The plurality of coolant channels may be distributed within the housing base such that a region of the housing base arranged opposite the power electronics unit and/or a region of the housing base arranged opposite the venting space has a higher coolant channel density than a region of the housing base arranged opposite the transmitting coil.

A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.

A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.

A housing is provided for mounting within an enclosure, for example a module for cooling electronic devices, that is arranged to contain a liquid coolant. The housing comprises: a wall structure, arranged to define a plurality of mounting chambers, each mounting chamber being configured to hold at least one respective electronic device and having a respective chamber coolant inlet for receiving liquid coolant, such that liquid coolant received through each chamber coolant inlet accumulates in the respective mounting chamber around the respective electronic device; a housing coolant inlet, for receiving liquid coolant from outside the housing; and a liquid coolant manifold, arranged to receive liquid coolant from the housing coolant inlet and provide the received liquid coolant to each of the chamber coolant inlets.

A composition includes a perfluorinated propenylamine represented by the following general formula (1): Each occurrence of Rf1 and Rf2 is: (i) independently a linear or branched perfluoroalkyl group having 1-8 carbon atoms and optionally comprises one or more catenated heteroatoms; or (ii) bonded together to form a ring structure having 4-8 carbon atoms and that optionally comprises one or more catenated heteroatoms. At least 60 wt. % of the perfluorinated propenylamine is in the form of the E isomer, based on the total weight of the perfluorinated propenylamine in the composition. ##STR00001##

A heat dissipation assembly is configured to be thermally coupled to a heat source. The heat dissipation assembly includes a thermoelectric cooler and a heat dissipation component. The thermoelectric cooler has a cold surface and a hot surface. The cold surface faces away from the hot surface, and the cold surface is configured to be thermally coupled to the heat source. The heat dissipation component is thermally coupled to the hot surface of the thermoelectric cooler.

An information handling resource may include a heat-generating component and a housing configured to house the heat-generating component, the housing comprising a plurality of openings formed thereon such that a liquid coolant may flow between an exterior of the housing and an interior of the housing.

A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes an inlet manifold and an outlet manifold, and one or more fluid pathways extending connecting the inlet manifold and the outlet manifold, the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. Thee one or more fluid pathways include one or more internal enhancements and channel configurations to enhance thermal energy transfer by promoting boiling of the flow of fluid and to reduce the pressure drop in the pathways under a two-phase flow condition. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system.

A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.