A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

A knockdown water-cooling module latch device structure is assembled and connected with a water-cooling module. The knockdown water-cooling module latch device structure includes a latch device assembly having multiple latch members. The multiple latch members are correspondingly assembled and connected with each other around the water-cooling module to form the knockdown water-cooling module latch device structure, whereby the water-cooling module is framed in the latch device assembly. The knockdown water-cooling module latch device structure can be conveniently assembled and has high assembling freeness and better structural strength.

A method includes receiving a power supply unit (“PSU”) replacement signal for a power supply chassis that includes plurality of supply enclosures. Each power supply enclosure includes a plurality of power supply units (“PSUs”). Each of the PSUs in the power supply enclosures is connected to a power bus powering computing equipment. PSU redundancy policy has at least one PSU being redundant. In response to the PSU replacement signal, the method calculates a power cap limit equal to a capacity of the plurality of supply enclosures that are not being removed. Power consumption of the computing equipment is limited to the power cap limit. In response to detecting a replacement power supply enclosure, the method recalculates the power cap limit based on all of the PSUs according to the PSU redundancy policy. Power consumption of the computing equipment is limited to the recalculated power cap limit.

A semiconductor device including a substrate, a semiconductor package, a plurality of pillars and a lid is provided. The semiconductor package is disposed on the substrate and includes at least one semiconductor die. The plurality of pillars are disposed on the semiconductor package. The lid is disposed on the substrate and covers the semiconductor package and the plurality of pillars. The lid includes an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid. An inner surface of the lid, which faces and overlaps the plurality of pillars along a stacking direction of the semiconductor package and the lid, is a flat surface.

A housing for electrical components is provided with a substrate. Sidewalls extend from the substrate to define a cavity configured to receive electrical components. A cooling channel is formed integrally along and unitary with the substrate, spaced apart from the cavity, with a mating surface for at least one fluid cover. At least one fluid cover is mountable on the mating surface for at least one fluid cover to enclose the cooling channel and to redirect a fluid when present within the cooling channel.

A connector assembly includes cages arranged as an upper cage and a lower cage in an up-down direction, a receptacle connector, a first liquid cooling tray and a second liquid cooling tray. Each cage includes a frame and a plurality of partitioning walls provided to the frame, and the frame and the plurality of partitioning walls together define a plurality of insertion space arranged transversely. The first liquid cooling tray is provided to a top portion of the upper cage and constitutes an upper wall surface of each of the plurality of insertion space of the upper cage. The second liquid cooling tray is provided between the upper cage and the lower cage, constitutes a lower wall surface of each of the plurality of insertion spaces of the upper cage, and constitutes an upper wall surface of each of the plurality of insertion space of the lower cage. A pressuring spring corresponding to each insertion space of the upper cage is provided on the upper surface of the second liquid cooling tray, and a pressuring spring corresponding to each insertion space of the lower cage is provided on the bottom plate.

A power adapter includes a housing body, a rear cover, a circuit board assembly, a first guide connector, a second guide connector, and a thermally conductive liquid. The housing body and the rear cover are connected in a sealed manner and enclose to form an accommodating cavity, the circuit board assembly is disposed in the accommodating cavity, the thermally conductive liquid fills the accommodating cavity and wraps the circuit board assembly, the housing body includes a front end wall disposed opposite to the rear cover, the first guide connector is mounted on the front end wall and connected to the front end wall in a sealed manner, the second guide connector is mounted on the rear cover and is connected to the rear cover in a sealed manner.

A charging pile is provided by the present disclosure, including: a charging unit and at least one liquid cooling radiator arranged in a box of the charging pile; a power conversion unit of the charging unit is arranged on a contact surface outside the liquid cooling radiator; and the liquid cooling radiator is configured to dissipate heat for the charging unit by means of convective heat exchange of cooling liquid, thereby avoiding need to design a heat dissipation module for each power conversion module in the charging pile and then perform a secondary heat dissipation design on the entire charging pile in the conventional technology, which reduces cost of the charging pile and improves a level of protection of the charging pile.

The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin. The disclosure also relates to a method for making the liquid cooling heat exchanger.

In one embodiment, a method includes delivering power and data on a cable from a central network device to a splitter device for splitting and transmitting the power and data to a plurality of remote communications devices over a plurality of cables, each of the cables carrying the power and data, receiving at the central network device, monitoring information from the remote communications devices on the cable, processing the monitoring information, and allocating the power and data to each of the remote communications devices based on the monitoring information. The power and data comprises pulsed power and optical data. A system is also disclosed herein.