Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

A heat dissipation structure is provided. The heat dissipation structure includes a heat dissipation unit and a fixation unit. The fixation unit has a bottom and a wall that jointly define a hollow area. The fixation unit is surroundingly arranged on a periphery of a heating source. The hollow area has a first non-masking area, a second non-masking area, and a masking area. The masking area corresponds to at least one part of the heat dissipation unit, and the first non-masking area and the second non-masking area are respectively arranged on opposite sides of the masking area. The first non-masking area has a first volume, the second non-masking area has a second volume, and a sum of the first volume and the second volume is at least greater than a predetermined volume change of the heat dissipation unit.

A novel heat transfer system is herein proposed involving a coupler which, when attached to a heat sink, defines at least a part of a vapor chamber inside the heat transfer system. The coupler attaches component heat source to the header to a thermally transferring connection with the heat sink.

A computer-implemented method, system and computer program product for detecting or predicting system faults in cooling systems. A model (deep learning model) is built and trained to detect or predict system faults in a cooling system based on acoustic emission signals (both in temporal and frequency domains) and/or imaging signals. Upon training the model to detect or predict system faults in a cooling system, acoustic emission signals may be obtained non-intrusively from the cooling system using acoustic emission sensors, hydrophones and/or microphones. Additionally, upon training the model to detect or predict system faults in a cooling system, imaging signals (e.g., boiling images) may be obtained non-intrusively from the cooling system using optical sensors (e.g., high-speed camera). The trained model may then detect or predict a system fault in the cooling system based on such information (acoustic emission signals, including in temporal and frequency domains, and/or the imaging signals).

The present invention is notably directed to a cooling device, e.g., for computer hardware. The device comprises a deformable, outer chamber, having at least one thermally conducting section, the latter suited for thermally contacting a heat source of a computer hardware. The outer chamber is deformable upon a pressure increase therein. The cooling device further comprises at least one inner chamber nested in the outer chamber, the inner chamber expandable in volume upon a pressure increase therein. The invention is further directed to a computer hardware apparatus comprising such a cooling device, or stacks of such cooling devices paired with respective set of electronic components.

The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.

A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

An air conditioner is provided. The air conditioner may include an electronic device, which may include a control component to drive a refrigerant cycle, and a cooling tube through which a refrigerant to cool the electronic device may flow. The cooling tube may be coupled to one side of the electronic device. The electronic device may include an electronic case having at least one through hole, an electronic board to which the control component may be coupled, the electronic board being disposed in the electronic case, at least one heat transfer plate disposed to contact the control component, the at least one heat transfer plate being coupled to the electronic case, and at least one heat sink, to which the cooling tube may be coupled, the at least one heat sink contacting the at least one heat transfer plate through the at least one through hole.

A vapor chamber composed of a lower shell, an upper shell and a working fluid is revealed. The upper and lower shells made of metal composite plates are connected closely to form a vacuum sealed cavity which the working fluid is filled in. The metal composite plate includes a metal matrix and a copper layer bonded to a surface of at least one side of the metal matrix. The metal matrix includes stainless steel and an aluminum silicon carbide (Al/SiC) metal matrix composite. The copper layer of the metal composite plate is treated by stamping process to form a support member inside the cavity. Thus complicated, polluting and high cost etching process is no more required. Therefore the production efficiency is improved and the cost is reduced. The metal matrix of the metal composite plate provides sufficient structural strength.