Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

A power conductor for conducting electricity between a power source and a load is disclosed. A conductive body connects between the power source and the load. A sealed chamber is provided in the interior of the conductive body and contains a working fluid for changing phase when heated. A circuit, a vehicle power distribution circuit, and a vehicle incorporating the same are also disclosed.

A heat-dissipating module including heat-dissipating fins and heat pipes is provided. The heat-dissipating fins include first and second heat-dissipating fins arranged in an interleaved, spaced apart manner, and arranged in parallel along a first direction. The first heat-dissipating fins have interleaved first vias and first breach holes. The second heat-dissipating fins have interleaved second vias and second breach hole. The first breach holes and the second breach holes are arranged along a second direction, and the second vias respectively correspond to the first vias. The first direction is not parallel to the second direction. The heat pipes are configured to pass through the first vias and the second vias. A position of the orthogonal projection of a first breach hole formed on the second heat-dissipating fins along the first direction and the corresponding second breach hole are not overlap or are partially overlapped, and are arranged in symmetry.

Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.

An example apparatus may include a first plate having a first side. A first plurality of fins may be integral with the first side of the first plate and protruding perpendicularly therefrom. The first plurality of fins may be arranged in first concentric circles separated radially by a first distance. The apparatus may also include a second plate having a first side. The second plate may be rotatably coupled to the first plate. A second plurality of fins may be integral with the first side of the second plate and protruding perpendicularly therefrom. The second plurality of fins may be arranged in second concentric circles separated radially by the first distance. Each fin of the second plurality of fins may interpose between adjacent fins of the first plurality of fins to transfer heat between the second plate and the first plate.

A VR integrated machine and a running method thereof are provided. The VR integrated machine includes a heat generating device, a heat conducting member and thermoelectric conversion member, the heat conducting member is connected with the heat generating device, the thermoelectric conversion member has a first end connected with the heat conducting member, and is configured to generate electrical energy and to supply the electrical energy to the UR integrated machine.

A first cooling apparatus includes a first heat sink having multiple first fins having a U-shaped opening and an O-shaped opening which are provide therein, a first heat receiving member configured to be brought into abutment with a heat source, and a first heat pipe which extends from one end which is connected with the heat receiving member towards the other end, and the first heat pipe has a first extending portion which extends from the one end, a bent portion which is bent from the first extending portion and at least a part of which is disposed inside the U-shaped opening, and a second extending portion which extends from the bent portion and at least a part of which is disposed inside the O-shaped opening.