An electronic circuit including: a circuit board; a temperature detection element mounted on the circuit board to detect an ambient temperature; and a circuit element mounted on the circuit board and generating heat in conjunction with circuit operation. The circuit board has a conductive pattern with a heat transfer property that is electrically connected to any terminal of the circuit element and transfers the heat generated by the circuit element. The conductive pattern with a heat transfer property is formed in an area outside a range within a predetermined distance from the temperature detection element. In the case where the temperature detection element is electrically connected to the conductive pattern with a heat transfer property, the connection is made via a linear wiring pattern or a linear wiring member.

An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

A system for thermal management of a computing device includes an immersion chamber, a cooling fluid, a plurality of heat-generating components, and a means for removing vapor from a cooling volume of the cooling fluid. The cooling fluid is positioned in the immersion chamber and fills at least a portion of the immersion chamber. The plurality of heat-generating components is positioned in the cooling fluid and arranged in a series. The series defines the cooling volume of the cooling fluid contacting the plurality of heat-generating components to cool the plurality of heat-generating components.

A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.

Embodiments of this application provide an electronic device, which solves the problem of mutual influence between a heat dissipation component and a patch antenna in the electronic device by multiplexing a heat sink in the electronic device. The heat sink provided by the embodiments of this application can be used as a heat dissipation component to distribute heat evenly, so as to achieve the purpose of cooling down an overheated electronic element. In addition, the heat sink can be used as a radiator of an antenna to form an antenna unit with the feed unit and generate radiation to the outside. The heat sink in a first region can be used as a main radiator of the antenna unit to meet the demand for the number of antennas in a 5G wireless communication system, and can also be applied to other communication systems.

A cooling apparatus (100) cools a heat-generating instrument, such as an electronic instrument (2), installed in an installation apparatus. The cooling apparatus (100) includes a refrigerant flow path configured circularly by sequentially connecting a pump (1) that circulates a refrigerant in a liquid state, a cooler (3) that cools the heat-generating instrument with the refrigerant, and a radiator (5) that cools the refrigerant. The cooling apparatus (100) includes a discharge-side heat exchanger (7) provided in a flow path from the pump (1) to the cooler (3) in the refrigerant flow path, a suction-side heat exchanger (8) provided in a flow path from the radiator (5) to the pump (1) in the refrigerant flow path, and a Peltier device (9) that is provided between the discharge-side heat exchanger (7) and the suction-side heat exchanger (8), and transfers heat from the refrigerant flowing through the suction-side heat exchanger (8) to the refrigerant flowing through the discharge-side heat exchanger (7).

A tight-fit riveting structure for a heat dissipation aluminum base and a heat pipe includes a heat dissipation aluminum base, a heat pipe, and a holder. When the heat dissipation aluminum base is to be manufactured, an upper surface of a thin aluminum plate is pressed downward to form an arched portion. The arched portion protrudes below the thin aluminum plate. A cavity is defined in the arched portion. The cavity has an upper end opening. The cavity has an inner width corresponding to an outer width of the heat pipe. The cavity has a depth greater than a thickness of the heat pipe.

A radiator with high-temperature performance includes a radiating pipe, a heat conducting pipe, an aluminum radiating plate, a main radiating part, and an auxiliary radiating part. The radiating pipe comprises a first end in contact with a heat-generating chip, and a second end. The heat conducting pipe is arranged on both sides of the first end of the heat radiating pipe. The first end and the heat conducting pipe are nested in the aluminum radiating plate. The first heat sink is arranged on the side of the heat dissipation pipe away from the chip. The auxiliary heat dissipation part is connected with the second end. The radiator disclosed improves all-round heat dissipation efficiency and meets the heat dissipation requirements of higher chip power through the heat conduction pipe arranged on the side of the heat dissipation pipe.

A heat spreading element is provided. The heat spreading element includes compressible pyrolytic graphite sheets and rigid pyrolytic graphite sheets interleaved with the compressible pyrolytic graphite sheets.

An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU) operatively coupled to the processor; a cooling fan operatively coupled to the processor to draw air into and direct air out of a base chassis of the information handling system, the cooling fan including a fan housing; and a radio module operatively coupled to the fan housing to be cooled by conduction to the fan housing and operation of the fan via convective cooling.